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1. (WO2017201847) HEAT-INSULATING POLYIMIDE COMPOSITE FILM USED IN ELECTRIC HEATING FILM SUBSTRATE
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Pub. No.: WO/2017/201847 International Application No.: PCT/CN2016/090288
Publication Date: 30.11.2017 International Filing Date: 18.07.2016
IPC:
C08L 79/08 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Applicants: COREHELM ELECTRONIC MATERIALS CO.,LTD[CN/CN]; Chen Jia xing 6th Floor, No.9, Ninth keji Road, Songshanhu high-tech development zone Dongguan City, Guangdong 523808, CN
Inventors: SU, Guanxian; CN
LIAO, Yuchao; CN
Agent: BEIJING KEYI INTELLECTUAL PROPERTY FIRM; Tang dongfeng No.1-2-502 of Hejingyuan, Jimenli, Hai Dian District, Peking, P.R.C. Beijing 100088, CN
Priority Data:
201610342519.723.05.2016CN
Title (EN) HEAT-INSULATING POLYIMIDE COMPOSITE FILM USED IN ELECTRIC HEATING FILM SUBSTRATE
(FR) PELLICULE COMPOSITE DE POLYIMIDE THERMOISOLANTE UTILISÉE DANS UN SUBSTRAT DE PELLICULE CHAUFFANTE ÉLECTRIQUE
(ZH) 一种用于电热发热薄膜基材的绝热聚酰亚胺复合薄膜
Abstract:
(EN) A heat-insulating polyimide composite film used in an electric heating film substrate. The polyimide composite thin film comprises: a polyimide resin, and modified SiO2 hollow spheres uniformly distributed in the polyimide resin. The modified SiO2 hollow sphere is manufactured by modifying a SiO2 hollow sphere with a KH550 silane coupling agent; the mass ratio of the modified SiO2 hollow sphere is at most 3.0% of the polyimide resin. The heat-insulating polyimide composite film used in the electric heating film substrate has the following advantages: 1. the SiO2 hollow spheres provide excellent heat insulating performance and can effectively reduce the thermal conductivity of the polyimide resin, and using the KH550 silane coupling agent to modify the surface of the SiO2 hollow spheres ensures that a functional component is highly dispersed within the substrate; 2. the thermal conductivity can be lowered to 0.07 W/mK to achieve a thermal insulation effect, thereby achieving a near-unidirectional heat transfer when the thin film is used as the electric heating film substrate.
(FR) Pellicule composite de polyimide thermoisolante utilisée dans un substrat de pellicule chauffante électrique. La pellicule fine composite de polyimide comprend : une résine polyimide et des sphères creuses de SiO2 modifiées uniformément distribuées dans la résine polyimide. La sphère creuse de SiO2 modifiée est fabriquée par modification d'une sphère creuse de SiO2 par un agent de couplage silane KH550 ; le rapport massique de la sphère creuse de SiO2 modifiée représente au plus 3,0 % de la résine polyimide. Le film composite de polyimide thermo-isolant utilisé dans le substrat de pellicule chauffante électrique présente les avantages suivants : 1. les sphères creuses de SiO2 présentent d'excellentes performances d'isolation thermique et peuvent réduire efficacement la conductivité thermique de la résine de polyimide, et l'utilisation de l'agent de couplage silane KH550 pour modifier la surface des sphères creuses de SiO2 assure qu'un composant fonctionnel est fortement dispersé à l'intérieur du substrat ; 2. la conductivité thermique peut être abaissée à 0,07 W/mK pour obtenir un effet d'isolation thermique, réalisant ainsi un transfert de chaleur quasi-unidirectionnel lorsque la pellicule mince est utilisée comme substrat de pellicule chauffante électrique.
(ZH) 一种用于电热发热薄膜基材的绝热聚酰亚胺复合薄膜,其包括聚酰亚胺树脂、均匀分散于聚酰亚胺树脂的改性SiO2空心球,改性SiO2空心球由SiO2空心球经硅烷偶联剂KH550改性制备而成,改性SiO2空心球的含量按质量比不大于聚酰亚胺树脂的3.0%;该用于电热发热薄膜基材的绝热聚酰亚胺复合薄膜具有以下优点:1、SiO2空心球具有优异的隔热性能,其可有效地降低聚酰亚胺树脂的导热系数,且采用硅烷偶联剂KH550对SiO2空心球进行表面改性,实现功能组份在基材中的高度分散;2、导热系数可降至0.07W/mK,绝热效果,在作为电热发热薄膜基材使用时可实现近似单向传热的效果。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)