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1. (WO2017201438) MICROFLUIDIC MODULE, SYSTEM AND KIT HAVING MAGNETIC INTERCONNECTS ON OPPOSITE SIDE OF INLET AND OUTLET OPENINGS
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Pub. No.: WO/2017/201438 International Application No.: PCT/US2017/033595
Publication Date: 23.11.2017 International Filing Date: 19.05.2017
IPC:
B01L 3/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
01
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
L
CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
3
Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
Applicants:
CORNING INCORPORATED [US/US]; 1 Riverfront Plaza Corning, New York 14831, US
Inventors:
YUEN, Po Ki; US
Agent:
WILKS, Susan S; US
Priority Data:
62/339,48020.05.2016US
62/377,98822.08.2016US
62/405,63307.10.2016US
Title (EN) MICROFLUIDIC MODULE, SYSTEM AND KIT HAVING MAGNETIC INTERCONNECTS ON OPPOSITE SIDE OF INLET AND OUTLET OPENINGS
(FR) MODULE MICROFLUIDIQUE, SYSTÈME ET KIT COMPORTANT DES INTERCONNEXIONS MAGNÉTIQUES SUR LE CÔTÉ OPPOSÉ D'OUVERTURES D'ENTRÉE ET DE SORTIE
Abstract:
(EN) A microfluidic module is described herein which incorporates magnetic interconnects. In addition, a modular microfluidic system, and a microfluidic kit are described herein which include one or more of the microfluidic modules which incorporate magnetic interconnects. Moreover, a method is described herein for manufacturing the microfluidic module which incorporates the magnetic interconnects.
(FR) L'invention concerne un module microfluidique comportant des interconnexions magnétiques. L'invention concerne également un système microfluidique modulaire et un kit microfluidique qui comprennent un ou plusieurs des modules microfluidiques comportant des interconnexions magnétiques. L'invention concerne par ailleurs un procédé de fabrication du module microfluidique qui comporte les interconnexions magnétiques.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)