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1. (WO2017201294) METHOD OF MANUFACTURING CIRCUIT BOARDS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/201294    International Application No.:    PCT/US2017/033342
Publication Date: 23.11.2017 International Filing Date: 18.05.2017
IPC:
H05K 3/38 (2006.01), H05K 1/02 (2006.01), H05K 3/02 (2006.01), H05K 3/46 (2006.01)
Applicants: ISOLA USA CORP. [US/US]; 3100 W. Ray Road, Suite 301 Chandler, AZ 85226 (US).
GAY, Michael [US/US]; (US) (US only)
Inventors: GAY, Michael; (US)
Agent: HUGHES, A., Blair; (US)
Priority Data:
62/337,979 18.05.2016 US
Title (EN) METHOD OF MANUFACTURING CIRCUIT BOARDS
(FR) PROCÉDÉS DE FABRICATION DE CARTES DE CIRCUITS IMPRIMÉS
Abstract: front page image
(EN)Methods for manufacturing electrical circuits on laminates from low profile copper layers where one or more of the circuits have known and reproducible signal losses. The method for manufacturing printed circuit boards (40) comprising the steps of: providing a planar sheet (16) including a planar dielectric material layer having a first planar surface and a second planar surface, and first copper foil sheet (10) having a first planar surface and a second planar surface wherein the first copper foil planar surface is associated with the first dielectric material layer planar surface and wherein the first copper foil sheet first surface and second surface each include a bond enhancement layer (12, 14); and forming a circuit pattern (32, 34, 36) in the first planar copper sheet by removing unnecessary portions of the first planar copper sheet while leaving the circuit pattern copper in place to form an inner layer sheet including a circuit pattern wherein a bond enhancement layer is not applied to the circuit pattern after forming the circuit pattern.
(FR)La présente invention concerne des procédés de fabrication de circuits électriques sur des stratifiés à partir de couches de cuivre à profil bas, un ou plusieurs desdits circuits présentant des pertes de signal connues et reproductibles.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)