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1. (WO2017200701) DOUBLE-SIDED CIRCUIT

Pub. No.:    WO/2017/200701    International Application No.:    PCT/US2017/028851
Publication Date: Fri Nov 24 00:59:59 CET 2017 International Filing Date: Sat Apr 22 01:59:59 CEST 2017
IPC: H03H 7/01
H03H 7/09
H01P 1/203
H05K 1/18
H01F 5/00
H01F 41/04
Applicants: QUALCOMM INCORPORATED
Inventors: YUN, Changhan Hobie
BERDY, David Francis
ZUO, Chengjie
KIM, Daeik Daniel
KIM, Jonghae
VELEZ, Mario Francisco
MUDAKATTE, Niranjan Sunil
MIKULKA, Robert Paul
Title: DOUBLE-SIDED CIRCUIT
Abstract:
The present disclosure provides circuits and methods for fabricating circuits. A circuit may include an insulator having a first surface, a second surface, a periphery, a first subset of circuit elements disposed on the first surface, a second subset of circuit elements disposed on the second surface, and at least one conductive sidewall disposed on the periphery, wherein the conductive sidewall electrically couples the first subset of circuit elements to the second subset of circuit elements.