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1. (WO2017200561) HIGH-POWER AMPLIFIER PACKAGE

Pub. No.:    WO/2017/200561    International Application No.:    PCT/US2016/049813
Publication Date: Fri Nov 24 00:59:59 CET 2017 International Filing Date: Fri Sep 02 01:59:59 CEST 2016
IPC: H01L 21/8258
H01L 23/367
H01L 23/495
H01L 27/06
Applicants: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Inventors: GITTEMEIER, Timothy
Title: HIGH-POWER AMPLIFIER PACKAGE
Abstract:
Package assemblies for improving heat dissipation of high-power components in microwave circuits are described. A laminate that includes microwave circuitry may have cut-outs that allow high-power components to be mounted directly on a heat slug below the laminate. Electrical connections to circuitry on the laminate may be made with wire bonds. The packaging allows more flexible design and tuning of packaged microwave circuitry.