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|1. (WO2017200361) LEAD-FREE SOLDER ALLOY COMPOSITION AND PREPARATION METHOD THEREFOR|
|Applicants:||UNIVERSITY OF SEOUL INDUSTRY COOPERATION FOUNDATION
|Inventors:||JUNG, Jae Pil
JUNG, Do Hyun
LIM, Dong Uk
|Title:||LEAD-FREE SOLDER ALLOY COMPOSITION AND PREPARATION METHOD THEREFOR|
The present invention relates to a lead-free solder alloy composition and a preparation method therefor, the composition comprising: a Sn-Ag-Cu first alloy; a Sn-Bi second alloy; one or more third alloys selected from Sn-Ag and Sn-Cu alloys; and an additive having a metal-coated ceramic nanopowder including a non-spherical shape. The present invention has an effect of enabling a lead-free solder alloy composition and a preparation method therefor to be provided, the composition being nontoxic and solving environmental problems caused by the toxicity of lead (Pb), thereby enabling the influence of a harmful metal element such as lead on the environment to be minimized and having excellent spreadability, wettability and mechanical properties.