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1. (WO2017200361) LEAD-FREE SOLDER ALLOY COMPOSITION AND PREPARATION METHOD THEREFOR

Pub. No.:    WO/2017/200361    International Application No.:    PCT/KR2017/005294
Publication Date: Fri Nov 24 00:59:59 CET 2017 International Filing Date: Tue May 23 01:59:59 CEST 2017
IPC: B23K 35/22
B23K 35/24
B23K 35/26
C22C 13/00
C22C 12/00
C23C 14/18
C23C 18/31
C23C 18/16
Applicants: UNIVERSITY OF SEOUL INDUSTRY COOPERATION FOUNDATION
서울시립대학교 산학협력단
Inventors: JUNG, Jae Pil
정재필
JUNG, Do Hyun
정도현
LIM, Dong Uk
임동욱
Title: LEAD-FREE SOLDER ALLOY COMPOSITION AND PREPARATION METHOD THEREFOR
Abstract:
The present invention relates to a lead-free solder alloy composition and a preparation method therefor, the composition comprising: a Sn-Ag-Cu first alloy; a Sn-Bi second alloy; one or more third alloys selected from Sn-Ag and Sn-Cu alloys; and an additive having a metal-coated ceramic nanopowder including a non-spherical shape. The present invention has an effect of enabling a lead-free solder alloy composition and a preparation method therefor to be provided, the composition being nontoxic and solving environmental problems caused by the toxicity of lead (Pb), thereby enabling the influence of a harmful metal element such as lead on the environment to be minimized and having excellent spreadability, wettability and mechanical properties.