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1. (WO2017200254) METHOD FOR DEPOSITING PROTECTION FILM OF LIGHT-EMITTING ELEMENT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/200254 International Application No.: PCT/KR2017/005042
Publication Date: 23.11.2017 International Filing Date: 16.05.2017
IPC:
H01L 51/52 (2006.01) ,H01L 21/02 (2006.01) ,H01L 51/56 (2006.01)
Applicants: TES CO.,LTD[KR/KR]; 2374-36 Jungbu-Daero, Yangji-Myun, Cheoin-Gu Yongin-Si Gyeonggi-do 17162, KR
Inventors: LEE, Hong-Jae; KR
KIM, Jong-Hwan; KR
SHIM, Woo-Pil; KR
LEE, Woo-Jin; KR
YOON, Sung-Yean; KR
LEE, Don-Hee; KR
Agent: LEE, Jae-Hong; KR
Priority Data:
10-2016-005994417.05.2016KR
Title (EN) METHOD FOR DEPOSITING PROTECTION FILM OF LIGHT-EMITTING ELEMENT
(FR) PROCÉDÉ DE DÉPÔT DE FILM DE PROTECTION D'ÉLÉMENT LUMINESCENT
(KO) 발광소자의 보호막 증착방법
Abstract: front page image
(EN) The present invention relates to a method for depositing a protection film of a light-emitting element, the method comprising the steps of: depositing a first inorganic protection film on a light-emitting element of a substrate; and depositing a second inorganic protection film, having comparatively smaller internal stress than the first inorganic protection film, on the first inorganic protection film.
(FR) La présente invention concerne un procédé de dépôt d'un film de protection d'un élément luminescent, le procédé comprenant les étapes consistant à : déposer un premier film de protection inorganique sur un élément luminescent d'un substrat; et le dépôt d'un second film de protection inorganique, présentant une contrainte interne comparativement plus faible que le premier film de protection inorganique, sur le premier film de protection inorganique.
(KO) 본 발명은 발광소자의 보호막 증착방법에 대한 것으로서, 상기 보호막 증착방법은 발광소자의 보호막 증착방법에 있어서 기판의 발광소자의 상부에 제1 무기 보호막을 증착하는 단계 및 상기 제1 무기 보호막보다 내부 응력이 상대적으로 작은 제2 무기 보호막을 상기 제1 무기 보호막의 상부에 증착하는 단계를 포함하는 것을 특징으로 한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)