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1. (WO2017199846) PRESS-FIT TERMINAL CONNECTION STRUCTURE

Pub. No.:    WO/2017/199846    International Application No.:    PCT/JP2017/017864
Publication Date: Fri Nov 24 00:59:59 CET 2017 International Filing Date: Fri May 12 01:59:59 CEST 2017
IPC: H01R 12/58
H01R 13/03
C25D 5/10
C25D 7/00
Applicants: AUTONETWORKS TECHNOLOGIES, LTD.
株式会社オートネットワーク技術研究所
SUMITOMO WIRING SYSTEMS, LTD.
住友電装株式会社
SUMITOMO ELECTRIC INDUSTRIES, LTD.
住友電気工業株式会社
Inventors: SHIRAI, Yoshimasa
白井 善晶
SAITOH, Yasushi
齋藤 寧
FURUKAWA, Kingo
古川 欣吾
KAWASAKI, Tetsuhiko
河崎 哲彦
OOKUBO, Masayuki
大久保 將之
WATANABE, Hajime
渡邉 玄
TSUCHIYA, Yoshiyasu
土屋 善康
KATO, Akihiro
加藤 暁博
Title: PRESS-FIT TERMINAL CONNECTION STRUCTURE
Abstract:
The objective of the invention is to provide a press-fit terminal connection structure in which a circuit board connection portion from a press-fit terminal is connected by being press-fitted into a through-hole provided on a printed circuit board, the press-fit terminal connection structure being capable of simultaneously improving the holding force for maintaining the press-fit terminal in an inserted state in the through-hole, and, when inserting and removing the press-fit terminal with respect to the through-hole, suppressing the scraping of the surface layer and reducing the load needed for the insertion and removal. This press-fit terminal connection structure comprises: the press-fit terminal having an alloy-containing layer 2c at least on a contact portion surface; and the through-hole having a tin layer 3c on the outermost surface of the inner peripheral surface including at least a contact portion. The alloy-containing layer 2c contains alloy portions 2c1, each comprising an alloy having tin and palladium as main components, and a tin portion 2c2 comprising pure tin or an alloy wherein the proportion of tin with respect to palladium is higher than that in each of the alloy portions 2c1. Domain structures from the alloy portions 2c1 are present in the tin portion 2c2, and some of the alloy portions 2c1 and the tin portion 2c2 both are exposed on the outermost surface of the alloy-containing layer 2c.