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Pub. No.:    WO/2017/199837    International Application No.:    PCT/JP2017/017840
Publication Date: 23.11.2017 International Filing Date: 11.05.2017
Chapter 2 Demand Filed:    17.10.2017    
H05K 1/18 (2006.01)
Applicants: AUTONETWORKS TECHNOLOGIES,LTD. [JP/JP]; 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503 (JP).
SUMITOMO WIRING SYSTEMS,LTD. [JP/JP]; 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503 (JP).
SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041 (JP)
Inventors: CHIN, Tou; (JP).
NAKAMURA, Arinobu; (JP)
Agent: YAMANO, Hiroshi; (JP)
Priority Data:
2016-101729 20.05.2016 JP
(JA) 回路構成体
Abstract: front page image
(EN)A circuit structure which is provided with: a circuit board having an upper surface on which a circuit pattern is formed; a bus bar which is affixed to the lower surface of the circuit board; an electronic component which has a package that is arranged on the bus bar, a first terminal that is exposed from the package and is electrically connected to the bus bar, and a second terminal that is exposed from the package and is electrically connected to the circuit pattern; and a flexible sheet member which electrically connects the circuit pattern and the second terminal to each other without being in contact with the bus bar.
(FR)L'invention porte sur une structure de circuit qui comporte : une carte de circuit imprimé ayant une surface supérieure sur laquelle est formé un motif de circuit; une barre omnibus qui est fixée à la surface inférieure de la carte de circuit imprimé; un composant électronique qui a un boîtier qui est disposé sur la barre omnibus, une première borne qui est exposée à partir du boîtier et est électriquement connectée à la barre omnibus, et une seconde borne qui est exposée à partir du boîtier et est électriquement connectée au motif de circuit; et un élément de feuille flexible qui connecte électriquement le motif de circuit et la seconde borne l'un à l'autre sans être en contact avec la barre omnibus.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)