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1. (WO2017199829) METHOD FOR MANUFACTURING METAL CLAD LAMINATED BOARD, METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD, AND RIGID BODY PENDULUM TYPE VISCOELASTICITY MEASURING DEVICE

Pub. No.:    WO/2017/199829    International Application No.:    PCT/JP2017/017792
Publication Date: Fri Nov 24 00:59:59 CET 2017 International Filing Date: Fri May 12 01:59:59 CEST 2017
IPC: H05K 3/38
B32B 15/08
B32B 38/18
Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
パナソニックIPマネジメント株式会社
Inventors: KOYAMA Masaya
小山 雅也
KOMORI Kiyotaka
古森 清孝
TAKAHASHI Hiroaki
高橋 広明
MATSUZAKI Yoshinori
松崎 義則
MORI Tadashi
森 正至
Title: METHOD FOR MANUFACTURING METAL CLAD LAMINATED BOARD, METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD, AND RIGID BODY PENDULUM TYPE VISCOELASTICITY MEASURING DEVICE
Abstract:
Included are: a step for removing the outermost layer of one surface or both surfaces of a liquid crystal polymer film (3); and a molding step in which a metal foil (4) is overlapped on the surface for which the outermost layer of the liquid crystal polymer film (3) was removed, and hot press molding is performed. The heating temperature for the molding step is within a range of the same temperature or higher compared to the melting start temperature of the liquid crystal polymer film (3) and a temperature not more than 60°C higher than the melting start temperature of the liquid crystal polymer film (3), measured using a rigid body pendulum type viscoelasticity measuring device.