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1. (WO2017199712) CERAMIC ELECTRONIC COMPONENT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/199712    International Application No.:    PCT/JP2017/016377
Publication Date: 23.11.2017 International Filing Date: 25.04.2017
IPC:
H05K 3/34 (2006.01), H05K 3/28 (2006.01)
Applicants: MURATA MANUFACTURING CO., LTD. [JP/JP]; 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555 (JP)
Inventors: TAKEMORI, Yuki; (JP)
Agent: YASUTOMI & ASSOCIATES; 5-36, Miyahara 3-chome, Yodogawa-ku, Osaka-shi, Osaka 5320003 (JP)
Priority Data:
2016-098041 16.05.2016 JP
Title (EN) CERAMIC ELECTRONIC COMPONENT
(FR) COMPOSANT ÉLECTRONIQUE EN CÉRAMIQUE
(JA) セラミック電子部品
Abstract: front page image
(EN)This ceramic electronic component is provided with: an electronic component main body which has a base ceramic layer in the surface; a surface electrode which is arranged on the surface of the electronic component main body; and a covering ceramic layer which covers an outer peripheral portion of the surface electrode. This ceramic electronic component is characterized in that the outer peripheral portion of the surface electrode covered by the covering ceramic layer has an opening.
(FR)La présente invention concerne un composant électronique en céramique qui est pourvu de : un corps principal de composant électronique qui comporte une couche de céramique de base dans la surface ; une électrode de surface qui est disposée sur la surface du corps principal de composant électronique ; et une couche de céramique de couverture qui recouvre une partie périphérique externe de l'électrode de surface. Ce composant électronique en céramique est caractérisé en ce que la partie périphérique externe de l'électrode de surface recouverte par la couche de céramique de couverture comporte une ouverture.
(JA)本発明のセラミック電子部品は、表面に基材セラミック層を有する電子部品本体と、上記電子部品本体の表面に設けられた表面電極と、上記表面電極の外周部を被覆する被覆セラミック層とを備えるセラミック電子部品であって、上記被覆セラミック層によって被覆された上記表面電極の外周部は、開口を有することを特徴とする。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)