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1. (WO2017199664) SN-PLATED ARTICLE AND METHOD FOR MANUFACTURING SAME
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Pub. No.: WO/2017/199664 International Application No.: PCT/JP2017/015545
Publication Date: 23.11.2017 International Filing Date: 18.04.2017
IPC:
C25D 7/00 (2006.01) ,C25D 5/12 (2006.01) ,C25D 5/50 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10
Electroplating with more than one layer of the same or of different metals
12
at least one layer being of nickel or chromium
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
50
by heat-treatment
Applicants:
DOWAメタルテック株式会社 DOWA METALTECH CO., LTD. [JP/JP]; 東京都千代田区外神田4-14-1 14-1, Sotokanda 4-chome, Chiyoda-ku, Tokyo 1010021, JP
矢崎総業株式会社 YAZAKI CORPORATION [JP/JP]; 東京都港区三田1-4-28 4-28, Mita 1-chome, Minato-ku, Tokyo 1088333, JP
Inventors:
小谷 浩隆 KOTANI Hirotaka; JP
成枝 宏人 NARIEDA Hiroto; JP
菅原 章 SUGAWARA Akira; JP
園田 悠太 SONODA Yuta; JP
伊藤 義貴 ITO Yoshitaka; JP
Agent:
大川 浩一 OKAWA Koichi; JP
Priority Data:
2016-10021119.05.2016JP
Title (EN) SN-PLATED ARTICLE AND METHOD FOR MANUFACTURING SAME
(FR) ARTICLE PLAQUÉ DE SN ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(JA) Snめっき材およびその製造方法
Abstract:
(EN) Provided is a Sn-plated article that has a glossiness of 0.3-0.7 and that is manufactured by electroplating a substrate, made of copper or a copper alloy, at a current density of 5-13 A/dm2 in a Sn-plating bath, which contains only stannous sulfate, sulfuric acid, and a surfactant in water, thereby forming a Sn-plated layer having a thickness of 0.4-3 μm on the substrate; then drying the surface of the Sn-plated layer, heating the surface of the Sn-plated layer to melt Sn and cooling the surface such that the layer on the outermost surface side of the Sn-plated layer is a Sn layer having a molten-solidified structure; then forming a Cu-Sn alloy layer on the substrate made of copper or a copper alloy, with a layer between the Sn layer and the substrate being the Cn-Sn alloy layer, and an Sn layer that has a molten-solidified structure being formed on this Cu-Sn alloy layer.
(FR) L'invention concerne un article plaqué de Sn présentant une brillance comprise entre 0,3 et 0,7 et fabriqué : par électroplacage d'un substrat constitué de cuivre ou d'un alliage de cuivre, à une densité de courant de 5 à 13 A/dm 2 dans un bain de placage de Sn qui contient uniquement du sulfate stanneux, de l'acide sulfurique et un tensioactif dans l'eau, formant ainsi une couche plaquée de Sn dotée d'une épaisseur de 0,4 à 3 µm sur le substrat ; puis par séchage de la surface de la couche plaquée de Sn, chauffage de la surface de la couche plaquée de Sn pour faire fondre Sn et refroidissement de la surface de sorte que la couche sur le côté de surface le plus à l'extérieur de la couche plaquée de Sn soit une couche de Sn présentant une structure solidifiée à l'état fondu ; puis par formation d'une couche d'alliage Cu-Sn sur le substrat en cuivre ou en alliage de cuivre, une couche entre la couche de Sn et le substrat étant la couche d'alliage Cn-Sn et une couche de Sn qui présente une structure solidifiée à l'état fondu étant formée sur cette couche d'alliage Cu-Sn.
(JA) 硫酸第一錫と硫酸と界面活性剤のみを水に添加したSnめっき浴中において電流密度5~13A/dmで電気めっきを行うことにより、銅または銅合金からなる基材上に厚さ0.4~3μmのSnめっき層を形成し、このSnめっき層の表面を乾燥させた後、Snめっき層の表面を加熱してSnを溶融させた後に冷却することにより、Snめっき層の最表面側の層を溶融凝固組織のSn層にするとともに、Sn層と基材の間の層をCu-Sn合金層にすることにより、銅または銅合金からなる基材上にCu-Sn合金層が形成され、このCu-Sn合金層上に溶融凝固組織のSn層が形成され、光沢度が0.3~0.7であるSnめっき材を製造する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)