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Pub. No.: WO/2017/199461 International Application No.: PCT/JP2017/000045
Publication Date: 23.11.2017 International Filing Date: 04.01.2017
H01F 27/29 (2006.01) ,H01F 17/00 (2006.01)
Applicants: MURATA MANUFACTURING CO., LTD.[JP/JP]; 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors: UEDA, Yoshinori; JP
KUDO, Hayami; JP
Agent: SAMEJIMA, Mutsumi; JP
Priority Data:
(JA) 電子部品
Abstract: front page image
(EN) This electronic component has a main body section including insulating layers and conductor layers, which are alternately laminated to each other. Some of the insulating layers and some of the conductor layers are exposed from the side surfaces of the main body section, said side surfaces being orthogonal to the lamination direction. The side surfaces of the main body section are respectively provided with metal films extending in the lamination direction, said metal films covering the insulating layers and the conductor layers, which are exposed from the side surfaces.
(FR) La présente invention concerne un composant électronique qui comporte une section de corps principal comprenant des couches isolantes et des couches conductrices, qui sont stratifiées de façon alternée les unes sur les autres. Certaines des couches isolantes et certaines des couches conductrices sont exposées depuis les surfaces latérales de la section de corps principal, lesdites surfaces latérales étant orthogonales à la direction de stratification. Les surfaces latérales de la section de corps principal sont respectivement pourvues de films métalliques s'étendant dans la direction de stratification, lesdits films métalliques recouvrant les couches isolantes et les couches conductrices, qui sont exposées depuis les surfaces latérales.
(JA) 電子部品は、交互に積層された絶縁層および導体層を含む本体部を有する。絶縁層および導体層の一部は、本体部の積層方向に直交する方向の側面に露出する。本体部の側面には、積層方向に延在して、側面に露出する絶縁層および導体層を覆う金属膜を設けている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)