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1. (WO2017199394) LED ELEMENT SUBSTRATE AND LED DISPLAY DEVICE

Pub. No.:    WO/2017/199394    International Application No.:    PCT/JP2016/064867
Publication Date: Fri Nov 24 00:59:59 CET 2017 International Filing Date: Fri May 20 01:59:59 CEST 2016
IPC: H01L 33/62
Applicants: DAI NIPPON PRINTING CO., LTD.
大日本印刷株式会社
Inventors: KOMAI, Takayuki
駒井 貴之
OOHASHI, Takuya
大橋 拓也
SHIBASAKI, Satoshi
柴崎 聡
EMOTO, Satoshi
江本 智史
Title: LED ELEMENT SUBSTRATE AND LED DISPLAY DEVICE
Abstract:
The present invention addresses the problem of reducing, in a flexible substrate-type LED element substrate, the risk of bending damage caused by the flexibility of a resin substrate and differences in flexural modulus between the resin substrate and metal wiring. An LED element substrate 1 is provided with a resin substrate 11 comprising a flexible resin film, and a metal wiring section 13 in which LED elements 2 arranged in a matrix shape are conductively formed on the resin substrate 11. The metal wiring section 13 comprises a plurality of circular or polygonal conductive plate sections 131 disposed on the resin substrate 11. Any given insulated slit section 132, which is a non-conductive area between two adjacent conductive plates 131, is not in line with any other adjacent insulating slit section 132.