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1. (WO2017195714) TRANSCEIVER MODULE, RECEPTACLE ASSEMBLY FOR TRANSCEIVER MODULE, AND TRANSCEIVER MODULE ASSEMBLY

Pub. No.:    WO/2017/195714    International Application No.:    PCT/JP2017/017335
Publication Date: Fri Nov 17 00:59:59 CET 2017 International Filing Date: Tue May 09 01:59:59 CEST 2017
IPC: H05K 1/11
Applicants: YAMAICHI ELECTRONICS CO., LTD.
山一電機株式会社
Inventors: ITO Toshiyasu
伊東 利育
TAKAI Yosuke
高居 陽介
Title: TRANSCEIVER MODULE, RECEPTACLE ASSEMBLY FOR TRANSCEIVER MODULE, AND TRANSCEIVER MODULE ASSEMBLY
Abstract:
An electrode unit of a module substrate 16 arranged inside a transceiver module 14 is formed by contact pad groups that are formed arrayed approximately parallel to the long side of the module substrate 16. The contact pad groups are configured to include a row of ground line pads 16EGi (i = 1 to 14) formed at prescribed intervals from one end to the other end, and two rows of signal line pads 16EAi, 16EBi (i = 1 to 36) formed between ground line pads 16EGi.