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1. (WO2017195639) WAFER LEVEL PACKAGE AND CAPACITOR
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/195639    International Application No.:    PCT/JP2017/016814
Publication Date: 16.11.2017 International Filing Date: 27.04.2017
IPC:
H01L 23/12 (2006.01), H01G 4/12 (2006.01), H01G 4/33 (2006.01)
Applicants: MURATA MANUFACTURING CO., LTD. [JP/JP]; 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555 (JP)
Inventors: FUNAKI, Tatsuya; (JP).
INOUE, Noriyuki; (JP)
Agent: SAMEJIMA, Mutsumi; (JP).
YOSHIDA, Tamaki; (JP)
Priority Data:
2016-097246 13.05.2016 JP
Title (EN) WAFER LEVEL PACKAGE AND CAPACITOR
(FR) BOÎTIER SUR TRANCHE ET CONDENSATEUR
(JA) ウエハレベルパッケージおよびキャパシタ
Abstract: front page image
(EN)The present invention provides a wafer level package formed by an IC chip, a rewiring layer provided on the IC chip, and a capacitor built into the rewiring layer.
(FR)La présente invention concerne un boîtier sur tranche formé par une puce de circuit intégré, une couche de recâblage disposée sur la puce de circuit intégré, et un condensateur incorporé dans la couche de recâblage.
(JA)本発明は、ICチップと、ICチップ上に設けられた再配線層と、再配線層に内蔵されたキャパシタとを有して成るウエハレベルパッケージを提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)