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1. (WO2017195275) HEAT PUMP SYSTEM

Pub. No.:    WO/2017/195275    International Application No.:    PCT/JP2016/063892
Publication Date: Fri Nov 17 00:59:59 CET 2017 International Filing Date: Wed May 11 01:59:59 CEST 2016
IPC: F25B 7/00
F25B 1/00
F25B 30/02
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: KADOWAKI, Kimitaka
門脇 仁隆
Title: HEAT PUMP SYSTEM
Abstract:
This heat pump system is provided with: a first piping for sequentially connecting a low temperature heating-side refrigerant circuit; a high temperature heating-side refrigerant circuit, a low temperature-side liquid supply port, a low temperature heating-side condenser, and a high temperature heating-side evaporator, and channeling a liquid; a second piping for sequentially connecting a high temperature-side liquid supply port and a high temperature heating-side condenser and channeling a liquid; a pump provided to the first piping, the pump pumping the liquid heated by the low temperature heating-side condenser to the high temperature heating-side evaporator; a control valve provided to the first piping between the low temperature heating-side condenser and the high temperature heating-side evaporator, the control valve controlling the flow rate of the liquid channeled through the first piping; and a control unit for controlling the pump and/or the control valve and controlling the flow rate of the liquid pumped from the low temperature heating-side condenser to the high temperature heating-side evaporator.