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Machine translation
1. (WO2017195058) SIMPLIFIED HERMETIC PACKAGING OF A MICRO-BATTERY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/195058    International Application No.:    PCT/IB2017/052411
Publication Date: 16.11.2017 International Filing Date: 26.04.2017
IPC:
H01M 10/04 (2006.01)
Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION [US/US]; New Orchard Road Armonk, New York 10504 (US).
IBM UNITED KINGDOM LIMITED [GB/GB]; PO Box 41, North Harbour Portsmouth Hampshire PO6 3AU (GB) (MG only).
IBM (CHINA) INVESTMENT COMPANY LIMITED [CN/CN]; 25/F, Pangu Plaza No.27, Central North 4th Ring Road, Chaoyang District, Beijing 100101 (CN) (MG only)
Inventors: DANG, Bing; (US).
ANDRY, Paul; (US).
WEBB, Bucknell; (US).
NAH, Jae-Woong; (US).
NARASGOND, Adinath, Shantinath; (US).
LIU, Yang; (US).
KNICKERBOCKER, John; (US)
Agent: GRAHAM, Timothy; (GB)
Priority Data:
62/333,523 09.05.2016 US
15/416,564 26.01.2017 US
Title (EN) SIMPLIFIED HERMETIC PACKAGING OF A MICRO-BATTERY
(FR) CONDITIONNEMENT HERMÉTIQUE SIMPLIFIÉ D'UNE MICRO-PILE
Abstract: front page image
(EN)A micro-battery (50A, 50B, 50C) is provided in which a metallic sealing layer (18) is used to provide a hermetic seal between an anode side of the micro-battery (50A, 50B, 50C) and the cathode side of the micro-battery (50A, 50B, 50C). The metallic sealing layer (18) is formed around a perimeter of each metallic anode structure (16) located on the anode side and then the metallic sealing layer (18) is bonded to a solderable metal layer (32) of a wall structure present on the cathode side. The wall structure contains a cavity (34) that exposes a metallic current collector structure (24). The cavity (34) is filled with battery materials (36).
(FR)L'invention concerne une micro-pile (50A, 50B, 50C) dans laquelle une couche d'étanchéité métallique (18) est utilisée pour former un joint hermétique entre un côté anode de la micro-pile (50A, 50B, 50C) et un côté cathode de la micro-pile (50A, 50B, 50C). La couche d'étanchéité métallique (18) est formée autour d'un périmètre de chaque structure d'anode métallique (16) située côté anode, la couche d'étanchéité métallique (18) étant ensuite collée à une couche métallique soudable (32) d'une structure de paroi présente côté cathode. La structure de paroi contient une cavité (34) qui laisse apparaître une structure de collecteur de courant métallique (24). La cavité (34) est remplie de matériaux de pile (36).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)