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Machine translation
1. (WO2017195052) INTEGRATED ELECTRO-OPTICAL MODULE ASSEMBLY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/195052 International Application No.: PCT/IB2017/052140
Publication Date: 16.11.2017 International Filing Date: 13.04.2017
IPC:
H01M 2/18 (2006.01)
Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION[US/US]; New Orchard Road Armonk, New York 10504, US
IBM UNITED KINGDOM LIMITED[GB/GB]; PO Box 41, North Harbour Portsmouth Hampshire PO6 3AU, GB (MG)
IBM (CHINA) INVESTMENT COMPANY LIMITED[CN/CN]; 25/F, Pangu Plaza No.27, Central North 4th Ring Road, Chaoyang District, Beijing 100101, CN (MG)
Inventors: DANG, Bing; US
CHEN, Qianwen; US
POLASTRE, Robert, John; US
WEBB, Bucknell; US
LU, Minhua; US
KNICKERBOCKER, John; US
ANDRY, Paul; US
Agent: LITHERLAND, David; GB
Priority Data:
15/452,93308.03.2017US
62/333,52509.05.2016US
Title (EN) INTEGRATED ELECTRO-OPTICAL MODULE ASSEMBLY
(FR) ENSEMBLE MODULE ÉLECTRO-OPTIQUE INTÉGRÉ
Abstract: front page image
(EN) An electro-optical module assembly is provided that includes a flexible substrate (12P) having a first surface (14A) and a second surface (14B) opposite the first surface (14A), wherein the flexible substrate (12P) contains an opening (17) located therein that extends from the first surface (14A) to the second surface (14B). An optical component (24) is located on the second surface (14B) of the flexible substrate (12P) and is positioned to have a surface exposed by the opening (17). At least one electronic component (16A, 16B) is located on a first portion of the first surface (14A) of the flexible substrate (12P), and at least one micro-energy source (28) is located on a second portion of the first surface (14A) of the flexible substrate (12P).
(FR) L'invention porte sur un ensemble module électro-optique qui comprend un substrat souple (12P) ayant une première surface (14A) et une seconde surface (14B) opposée à la première surface (14A), le substrat souple (12P) contenant en son sein une ouverture (17) qui s'étend de la première surface (14A) à la seconde surface (14B). Un composant optique (24) est situé sur la seconde surface (14B) du substrat souple (12P) et positionné de façon à exposer une surface par l'ouverture (17). Au moins un composant électronique (16A, 16B) est situé sur une première partie de la première surface (14A) du substrat souple (12P), et au moins une micro-source d'énergie (28) est située sur une seconde partie de la première surface (14A) du substrat souple (12P).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)