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1. (WO2017194996) INTEGRATED ALUMINUM HEAT SINK, ELASTOMER ON TALC FILLED PP HOUSING FOR ELECTRONIC MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/194996 International Application No.: PCT/IB2016/052715
Publication Date: 16.11.2017 International Filing Date: 12.05.2016
Chapter 2 Demand Filed: 09.02.2018
IPC:
H05K 7/20 (2006.01) ,H05K 5/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
Applicants:
CONTINENTAL AUTOMOTIVE GMBH [DE/DE]; Vahrenwalder Straße 9 30165 Hanover, DE
Inventors:
LIM, Kok Hee Abel; SG
KONG, Hian Keat Jeff; SG
ONG, Chye Keong; SG
Priority Data:
Title (EN) INTEGRATED ALUMINUM HEAT SINK, ELASTOMER ON TALC FILLED PP HOUSING FOR ELECTRONIC MODULE
(FR) DISSIPATEUR THERMIQUE EN ALUMINIUM INTÉGRÉ, ÉLASTOMÈRE SUR BOÎTIER PP CHARGÉ DE TALC POUR MODULE ÉLECTRONIQUE
Abstract:
(EN) The application provides a housing unit for an electronic device. The housing unit includes a heat sink for dissipating heat from the electronic device, and a plastic housing, which comprises talc filled polypropylene (PP) material, for connecting to the heat sink. The housing unit also includes one or more elastomer layers being provided on the heat sink, wherein the elastomer layer is provided between the heat sink and the plastic housing, and wherein the elastomer layer prevents the plastic housing from receiving an expansion force of the heat sink.
(FR) La présente invention concerne une unité de boîtier pour un dispositif électronique. L'unité de boîtier comprend un dissipateur thermique pour dissiper la chaleur provenant du dispositif électronique, et un boîtier en plastique, qui comprend un matériau de polypropylène (PP) chargé de talc, pour raccordement au dissipateur thermique. L'unité de boîtier comprend en outre une ou plusieurs couches d'élastomère étant disposées sur le dissipateur thermique, la couche d'élastomère étant disposée entre le dissipateur de chaleur et le boîtier en plastique, et la couche d'élastomère empêchant le boîtier en plastique de recevoir une force d'expansion du dissipateur thermique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)