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1. (WO2017194833) A METHOD OF FORMING AN APPARATUS COMPRISING QUANTUM DOTS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/194833 International Application No.: PCT/FI2017/050354
Publication Date: 16.11.2017 International Filing Date: 08.05.2017
IPC:
H01L 21/02 (2006.01) ,H01L 51/52 (2006.01) ,G01T 1/20 (2006.01) ,G01T 1/24 (2006.01) ,B32B 37/00 (2006.01) ,B82Y 30/00 (2011.01) ,B82Y 40/00 (2011.01)
Applicants: EMBERION OY[FI/FI]; Metsänneidonkuja 8 02130 Espoo, FI
Inventors: BESSONOV, Alexander; GB
BOWER, Chris; GB
WHITE, Richard; GB
MEDINA-SALAZAR, Ivonne; GB
RYHÄNEN, Tapani; FI
Agent: BOCO IP OY AB; Itämerenkatu 5 00180 Helsinki, FI
Priority Data:
16168722.309.05.2016EP
Title (EN) A METHOD OF FORMING AN APPARATUS COMPRISING QUANTUM DOTS
(FR) PROCÉDÉ DE FORMATION D'UN APPAREIL COMPORTANT DES POINTS QUANTIQUES
Abstract: front page image
(EN) A method and apparatus, the method comprising: depositing (11 ) a quantum dot solution (23) onto a first substrate (21); solidifying (13) the quantum dot solution (23) on the first substrate (21) to form a solid layer (25) of quantum dots; arranging (15) the first substrate (21) overlaying a second substrate (27) so that an electrical connection is established between the solid layer (25) of quantum dots and one or more electrical components on the second substrate (27).
(FR) L'invention concerne un procédé et appareil, le procédé comportant les étapes consistant à: déposer (11) une solution (23) de points quantiques sur un premier substrat (21); solidifier (13) la solution (23) de points quantiques sur le premier substrat (21) pour former une couche solide (25) de points quantiques; disposer (15) le premier substrat (21) superposé à un deuxième substrat (27) de telle façon qu'une connexion électrique soit établie entre la couche solide (25) de points quantiques et un ou plusieurs composants électriques présents sur le deuxième substrat (27).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)