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1. (WO2017193761) ENCAPSULATING MATERIAL, ENCAPSULATED COVER PLATE, SINTERING APPARATUS, SINTERING METHOD AND DISPLAY DEVICE
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Pub. No.: WO/2017/193761 International Application No.: PCT/CN2017/080394
Publication Date: 16.11.2017 International Filing Date: 13.04.2017
IPC:
H01L 51/52 (2006.01) ,H01L 51/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
Applicants: BOE TECHNOLOGY GROUP CO., LTD.[CN/CN]; No.10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.[CN/CN]; Ordos Equipment Manufacturing Base, DongshengDistrict, Ordos Inner Mongolia 017020, CN
Inventors: CHEN, Jingjing; CN
ZHANG, Liang; CN
CUI, Fuyi; CN
WANG, Lina; CN
LI, Xuwei; CN
Agent: CHINA SCIENCE PATENT & TRADEMARK AGENT LTD.; Suite 4-1105, No. 87, West 3rd Ring North Rd., Haidian District Beijing 100089, CN
Priority Data:
201610320276.713.05.2016CN
Title (EN) ENCAPSULATING MATERIAL, ENCAPSULATED COVER PLATE, SINTERING APPARATUS, SINTERING METHOD AND DISPLAY DEVICE
(FR) MATÉRIAU D'ENCAPSULATION, PLAQUE DE RECOUVREMENT ENCAPSULÉE, APPAREIL DE FRITTAGE, PROCÉDÉ DE FRITTAGE ET DISPOSITIF D'AFFICHAGE
(ZH) 一种封装材料、封装盖板、烧结设备、烧结方法及显示装置
Abstract:
(EN) Provided are an encapsulating material, an encapsulated cover plate, a sintering apparatus, a sintering method and a display device, relating to the technical field of display. Burrs on the surface of the encapsulating material can be improved and voids inside the encapsulating material can be reduced, thus the laser sealing ratio of the encapsulating material is increased and the encapsulating effect of the encapsulating material is improved. The encapsulating material comprises a levelling auxiliary material. During the sintering of the encapsulating material, the levelling auxiliary material moves when excited so as to level the encapsulating material and is used for the encapsulation of a cover plate and a cover plate to be encapsulated.
(FR) La présente invention concerne un matériau d'encapsulation, une plaque de recouvrement encapsulée, un appareil de frittage, un procédé de frittage et un dispositif d'affichage, concernant le domaine technique de l'affichage. Les bavures sur la surface du matériau d'encapsulation peuvent être améliorées et les vides à l'intérieur du matériau d'encapsulation peuvent être réduits, de sorte que le rapport d'étanchéité au laser du matériau d'encapsulation est augmenté et l'effet d'encapsulation du matériau d'encapsulation est amélioré. Le matériau d'encapsulation comprend un matériau auxiliaire de nivellement. Pendant le frittage du matériau d'encapsulation, le matériau auxiliaire de nivellement se déplace lorsqu'il est excité de façon à niveler le matériau d'encapsulation et est utilisé pour l'encapsulation d'une plaque de couverture et d'une plaque de couverture devant être encapsulée.
(ZH) 一种封装材料、封装盖板、烧结设备、烧结方法及显示装置,涉及显示技术领域,可改善封装材料表面的毛刺,并减少封装材料内部的孔洞,从而提高封装材料的激光封接比例,改善封装材料的封装效果。该封装材料包括流平辅助材料,在烧结封装材料时,所述流平辅助材料用于在受到激发时运动,以使封装材料流平,用于封装盖板和待封装盖板的封装。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)