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1. (WO2017193684) HIGH-DENSITY STAGGEREDLY-STACKED PCB BOARD CONNECTION DEVICE AND METHOD FOR IMPLEMENTING SAME

Pub. No.:    WO/2017/193684    International Application No.:    PCT/CN2017/075914
Publication Date: Fri Nov 17 00:59:59 CET 2017 International Filing Date: Thu Mar 09 00:59:59 CET 2017
IPC: H01R 12/72
H01R 13/02
H01R 43/26
Applicants: INSPUR ELECTRONIC INFORMATION INDUSTRY CO., LTD
浪潮电子信息产业股份有限公司
Inventors: WU, JiangHong
吴江红
Title: HIGH-DENSITY STAGGEREDLY-STACKED PCB BOARD CONNECTION DEVICE AND METHOD FOR IMPLEMENTING SAME
Abstract:
A high-density staggeredly-stacked PCB board and a method for implementing same, relating to the fields of server storage and switch hardware research and development. The high-density staggeredly-stacked PCB board connection device comprises a wire-end connector (1) and a board-end connector (2). The wire-end connector (1) uses one PCB board (3) on which an H1 area (4) and an H2 area (5) are provided, front contact goldfingers (6) being provided on both sides of the H1 area (4) and rear contact goldfingers (7) being provided on both sides of the H2 area (5). The board-end connector (2) comprises four rows of contact terminals (10), the two rows of contact terminals on an outer side forming a front-row contact bellow2 opening area (8) and the two rows of contact terminals on an inner side forming a rear-row contact bellow1 opening area (9). The front contact goldfingers (6) are snap-fitted with the rear-row contact bellow1 opening area (9), and the rear contact goldfingers (7) are snap-fitted with the front-row contact bellow2 opening area (8). The connection device and the method for implementing same achieve high-density signal transmission of PCB boards without increasing widths and heights of connectors.