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1. WO2017193592 - INTEGRATED CIRCUIT ENCAPSULATION APPARATUS PROVIDED WITH ANTENNA, AND MANUFACTURING METHOD THEREFOR

Publication Number WO/2017/193592
Publication Date 16.11.2017
International Application No. PCT/CN2016/112986
International Filing Date 29.12.2016
IPC
H01L 23/66 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
CPC
H01L 21/4853
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4846Leads on or in insulating or insulated substrates, e.g. metallisation
4853Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
H01L 2223/6616
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6605High-frequency electrical connections
6616Vertical connections, e.g. vias
H01L 2223/6677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6661for passive devices
6677for antenna, e.g. antenna included within housing of semiconductor device
H01L 23/481
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
481Internal lead connections, e.g. via connections, feedthrough structures
H01L 23/49838
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49838Geometry or layout
H01L 23/5226
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
5226Via connections in a multilevel interconnection structure
Applicants
  • 华为技术有限公司 HUAWEI TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • 陈特伟 CHEN, Tewei
  • 刘国文 LIU, Guowen
Agents
  • 北京三高永信知识产权代理有限责任公司 BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD.
Priority Data
201610318942.313.05.2016CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) INTEGRATED CIRCUIT ENCAPSULATION APPARATUS PROVIDED WITH ANTENNA, AND MANUFACTURING METHOD THEREFOR
(FR) APPAREIL D'ENCAPSULATION DE CIRCUIT INTÉGRÉ MUNI D'UNE ANTENNE ET SON PROCÉDÉ DE FABRICATION
(ZH) 设置有天线的集成电路封装装置及其制造方法
Abstract
(EN) An integrated circuit encapsulation apparatus provided with an antenna, and a manufacturing method therefor, falling within the field of encapsulation of integrated circuits. The integrated circuit encapsulation apparatus comprises: an encapsulation substrate (22), an antenna (23), a chip (24) and a connection circuit (25), wherein the encapsulation substrate (22) comprises at least one ground plane (21); the antenna (23) is arranged on an outer surface at one side of the encapsulation substrate (22) and is located at one side of the at least one ground plane (21); the chip (24) and the connection circuit (25) are arranged on the other side of the at least one ground plane (21) so as to isolate the antenna (23) from the chip (24) and the connection circuit (25) by means of the at least one ground plane (21); and the antenna (23) is connected to the chip (24) by means of a first metal via hole (26) in the thickness direction of the encapsulation substrate (22) and the connection circuit (25). The integrated circuit encapsulation apparatus increases the isolation between the antenna (23) and a non-antenna circuit comprising the chip (24) and the connection circuit (25), thereby improving the reliability and stability of the integrated circuit encapsulation apparatus.
(FR) La présente invention concerne un appareil d'encapsulation de circuit intégré pourvu d’une antenne, et son procédé de fabrication, appartenant au domaine de l'encapsulation des circuits intégrés. L'appareil d'encapsulation de circuit intégré comprend : un substrat d'encapsulation (22), une antenne (23), une puce (24) et un circuit de connexion (25), le substrat d'encapsulation (22) comprenant au moins un plan de sol (21) ; l'antenne (23) est agencée sur une surface externe d'un côté du substrat d'encapsulation (22) et est située d'un côté de l’au moins un plan de sol (21) ; la puce (24) et le circuit de connexion (25) sont agencés sur l'autre côté de l’au moins un plan de sol (21) de façon à isoler l'antenne (23) de la puce (24) et du circuit de connexion (25) au moyen dudit au moins un plan de sol (21) ; et l'antenne (23) est connectée à la puce (24) au moyen d'un premier trou d’interconnexion métallique (26) dans la direction de l'épaisseur du substrat d'encapsulation (22) et du circuit de connexion (25). L'appareil d'encapsulation de circuit intégré augmente l'isolation entre l'antenne (23) et un circuit non-antenne comprenant la puce (24) et le circuit de connexion (25), de façon à améliorer la fiabilité et la stabilité de l'appareil d'encapsulation de circuit intégré.
(ZH) 一种设置有天线的集成电路封装装置及其制造方法,属于集成电路的封装领域。集成电路封装装置包括:封装基板(22)、天线(23)、芯片(24)和连接电路(25),封装基板(22)包括至少一个接地平面(21),天线(23)设置在封装基板(22)一侧的外表面且位于至少一个接地平面(21)的一侧,芯片(24)和连接电路(25)设置在至少一个接地平面(21)的另一侧,以将天线(23)通过至少一个接地平面(21)与芯片(24)和连接电路(25)进行隔离,天线(23)通过封装基板(22)的厚度方向上的第一金属过孔(26)和连接电路(25)连接至芯片(24)。该集成电路封装装置提高了天线(23)和包括芯片(24)和连接电路(25)的非天线电路之间的隔离度,提高了集成电路封装装置的可靠性和稳定性。
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