WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2017192994) WAFER PROFILING FOR ETCHING SYSTEM
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/192994 International Application No.: PCT/US2017/031302
Publication Date: 09.11.2017 International Filing Date: 05.05.2017
IPC:
H01L 21/306 (2006.01) ,H01L 21/67 (2006.01)
Applicants: APPLIED MATERIALS, INC.[US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors: CHEUNG, Jeffrey, Chi; US
GHEKIERE, John; US
LEONHARD, Jerry, D.; US
SURDOCK, David, P.; US
SHAFER, Benjamin; US
YOUNG, Ray; US
Agent: GOREN, David, J.; US
Priority Data:
62/332,99206.05.2016US
62/489,32924.04.2017US
Title (EN) WAFER PROFILING FOR ETCHING SYSTEM
(FR) PROFILAGE DE TRANCHE POUR UN SYSTÈME DE GRAVURE
Abstract: front page image
(EN) A substrate etching system includes a support to hold a wafer in a face-up orientation, a dispenser arm movable laterally across the wafer on the support, the dispenser arm supporting a delivery port to selectively dispense a liquid etchant onto a portion of a top face of the wafer, and a monitoring system comprising a probe movable laterally across the wafer on the support.
(FR) L'invention concerne un système de gravure de substrat qui comprend un support pour maintenir une tranche orientée vers le haut, un bras de distribution pouvant se déplacer latéralement sur l'ensemble de la tranche sur le support, le bras de distribution supportant un orifice de distribution pour distribuer de manière sélective un agent de gravure liquide sur une partie d'une face supérieure de la tranche, et un système de surveillance comprenant une sonde pouvant se déplacer latéralement sur l'ensemble de la tranche sur le support.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)