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1. (WO2017192096) ASSEMBLY PLATFORM

Pub. No.:    WO/2017/192096    International Application No.:    PCT/SE2017/050430
Publication Date: Fri Nov 10 00:59:59 CET 2017 International Filing Date: Thu May 04 01:59:59 CEST 2017
IPC: H01L 23/498
H01L 23/50
Applicants: SMOLTEK AB
Inventors: KABIR, M Shafiqul
JOHANSSON, Anders
DESMARIS, Vincent
AMIN SALEEM, Muhammad
Title: ASSEMBLY PLATFORM
Abstract:
An assembly platform for arrangement as an interposer device between an integrated circuit and a substrate to interconnect the integrated circuit and the substrate through the assembly platform, the assembly platform comprising: an assembly substrate; a plurality of conducting vias extending through the assembly substrate; at least one nanostructure connection bump on a first side of the assembly substrate, the nanostructure connection bump being conductively connected to the vias and defining connection locations for connection with at least one of the integrated circuit and the substrate, wherein each of the nanostructure connection bumps comprises: a plurality of elongated conductive nanostructures vertically grown on the first side of the assembly substrate, wherein the plurality of elongated nanostructures are embedded in a metal for the connection with at least one of the integrated circuit and the substrate, at least one connection bump on a second side of the assembly substrate, the second side being opposite to the first side, the connection bump being conductively connected to the vias and defining connection locations for connection with at least one of the integrated circuit and the substrate.