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1. (WO2017192003) SOLDER BALL, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC PARTS USING SAME

Pub. No.:    WO/2017/192003    International Application No.:    PCT/KR2017/004686
Publication Date: Fri Nov 10 00:59:59 CET 2017 International Filing Date: Wed May 03 01:59:59 CEST 2017
IPC: H01L 23/00
H01L 23/488
B23K 35/02
B23K 1/00
Applicants: DUKSAN HIGH METAL CO., LTD.
덕산하이메탈(주)
Inventors: LEE, Hyun Kyu
이현규
KWAK, Jung Ug
곽정욱
KIM, Kyung Tae
김경태
CHUN, Myoung Ho
천명호
PARK, Eun Kwang
박은광
EUN, Dong Jin
은동진
CHU, Yong Cheol
추용철
Title: SOLDER BALL, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC PARTS USING SAME
Abstract:
A solder ball, a manufacturing method therefor, and electronic parts comprising the same are disclosed in the present specification. More specifically, disclosed is a solder ball which is applicable in all technical fields which are based on solder ball bonding, and especially may be used in semiconductor packages using solder balls as basic contacts in the electronics industry. The solder ball maintains the shape of a core comprising a metal having a low melting point even during reflow, and has stable bonding reliability with a substrate.