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|1. (WO2017192003) SOLDER BALL, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC PARTS USING SAME|
|Applicants:||DUKSAN HIGH METAL CO., LTD.
|Inventors:||LEE, Hyun Kyu
KWAK, Jung Ug
KIM, Kyung Tae
CHUN, Myoung Ho
PARK, Eun Kwang
EUN, Dong Jin
CHU, Yong Cheol
|Title:||SOLDER BALL, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC PARTS USING SAME|
A solder ball, a manufacturing method therefor, and electronic parts comprising the same are disclosed in the present specification. More specifically, disclosed is a solder ball which is applicable in all technical fields which are based on solder ball bonding, and especially may be used in semiconductor packages using solder balls as basic contacts in the electronics industry. The solder ball maintains the shape of a core comprising a metal having a low melting point even during reflow, and has stable bonding reliability with a substrate.