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Machine translation
1. (WO2017191935) TEMPERATURE MEASURING DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/191935 International Application No.: PCT/KR2017/004502
Publication Date: 09.11.2017 International Filing Date: 27.04.2017
IPC:
G01K 7/02 (2006.01) ,G01K 7/10 (2006.01) ,G01K 1/08 (2006.01) ,G01D 11/24 (2006.01) ,G01K 15/00 (2006.01)
Applicants: AUTONICS CORPORATION[KR/KR]; 18, Bansong-ro 513beon-gil, Haeundae-gu, Busan 48002, KR
Inventors: YOUN, Hyungseok; KR
Agent: ROYAL PATENT & LAW OFFICE; 1F., Dowon Bldg., 2072 Nambusunhwan-no, Gwanak-gu, Seoul 08806, KR
Priority Data:
10-2016-005450703.05.2016KR
Title (EN) TEMPERATURE MEASURING DEVICE
(FR) DISPOSITIF DE MESURE DE TEMPÉRATURE
(KO) 온도 측정 장치
Abstract: front page image
(EN) A temperature measuring device is disclosed. The temperature measuring device of the present invention comprises a housing, a plurality of terminal blocks coupled to the housing, and a main control PCB connected to the terminal blocks inside the housing, wherein the plurality of terminal blocks include first and second terminal blocks having a multiply-bent main coupling pin provided thereto, wherein the second terminal block further comprises: a temperature compensation PCB positioned on the upper surface of the main coupling pin; a temperature compensation sensor coupled on the upper surface of the temperature compensation PCB; and a sub-coupling pin coupled on the upper surface of the temperature compensation PCB and electrically connected with the temperature compensation sensor, wherein a first connection pin of the main coupling pin and a second connection pin of the sub-coupling pin are electrically connected, respectively, to a plurality of terminals formed on the main control PCB. According to the present invention, a through-hole is arranged so as to overlap with the temperature compensation sensor, and thus a short circuit between the main coupling pin and the sub-coupling pin may be prevented in advance, and thus product reliability may be improved.
(FR) L'invention concerne un dispositif de mesure de température. Le dispositif de mesure de température de la présente invention comprend un boîtier, une pluralité de blocs de borne couplés au boîtier, et une carte de circuit imprimé (PCB) de commande principale connectée aux blocs de borne à l'intérieur du boîtier, la pluralité de blocs terminaux comprenant des premier et second blocs de borne sur lesquels est disposée une broche de couplage principale pliée de façon multiple, le second bloc de borne comprenant en outre : une PCB de compensation de température positionnée sur la surface supérieure de la broche de couplage principale ; un capteur de compensation de température couplé sur la surface supérieure de la PCB de compensation de température ; et une broche de sous-couplage couplée sur la surface supérieure de la PCB de compensation de température et connectée électriquement au capteur de compensation de température, une première broche de connexion de la broche de couplage principale et une seconde broche de connexion de la broche de sous-couplage étant connectées électriquement, respectivement, à une pluralité de bornes formées sur la PCB de commande principale. Selon la présente invention, un trou traversant est agencé de manière à chevaucher le capteur de compensation de température, et ainsi un court-circuit entre la broche de couplage principale et la broche de sous-couplage peut être évité à l'avance, et de ce fait la fiabilité du produit peut être améliorée.
(KO) 온도 측정 장치가 개시된다. 본 발명의 온도 측정 장치는, 하우징, 하우징에 결합된 복수 개의 단자대 및 하우징 내부에서 단자대에 접속된 메인제어 PCB를 포함하되, 복수 개의 단자대는 복수회 밴딩된 메인결합핀이 형성된 제1,2 단자대를 포함하며, 제2 단자대는, 메인결합핀의 상면 상에 위치한 온도보상 PCB와, 온도보상 PCB의 상면 상에 결합된 온도보상센서와, 온도보상 PCB의 상면 상에 결합되고 온도보상센서와 전기적으로 연결된 서브결합핀을 더 포함하되, 메인결합핀의 제1 접속핀과 서브결합핀의 제2 접속핀은, 메인제어 PCB에 형성된 복수 개의 단자에 각각 전기적으로 접속된 것을 포함한다. 본 발명에 의하면, 스루홀을 보상용 온도센서와 중첩되도록 배치하여, 메인결합핀과 서브결합핀 간의 쇼트를 미연에 방지할 수 있어 제품의 신뢰성을 개선시킬 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)