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1. (WO2017191888) HOLLOW SHIELDING STRUCTURE FOR DIFFERENT TYPES OF CIRCUIT ELEMENTS AND MANUFACTURING METHOD THEREOF
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/191888 International Application No.: PCT/KR2017/001370
Publication Date: 09.11.2017 International Filing Date: 08.02.2017
IPC:
H05K 9/00 (2006.01) ,H05K 5/02 (2006.01) ,H01L 23/552 (2006.01)
Applicants: SAMSUNG ELECTRONICS CO., LTD.[KR/KR]; 129, Samsung-ro, Yeongtong-gu Suwon-si Gyeonggi-do 16677, KR
Inventors: KUK, Keon; KR
MUN, Il-ju; KR
YEOM, Ji-woon; KR
JUNG, Yeon-kyoung; KR
KIM, Kyong-il; KR
Agent: JEONG, Hong-sik; KR
Priority Data:
10-2016-010843525.08.2016KR
62/331,63004.05.2016US
Title (EN) HOLLOW SHIELDING STRUCTURE FOR DIFFERENT TYPES OF CIRCUIT ELEMENTS AND MANUFACTURING METHOD THEREOF
(FR) STRUCTURE DE PROTECTION CREUSE POUR DIFFÉRENTS TYPES D'ÉLÉMENTS DE CIRCUIT ET SON PROCÉDÉ DE FABRICATION
Abstract: front page image
(EN) A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
(FR) L'invention concerne une structure de protection creuse pour différents types d'éléments de circuit. La structure de protection creuse comprend au moins un élément monté sur une carte de circuit imprimé, un barrage de protection entourant le ou les éléments, et un couvercle de protection qui est conçu pour être couplé électriquement à une partie supérieure du barrage de protection et recouvrir ledit ou lesdits éléments, un espace étant formé entre le ou les éléments et le couvercle de protection.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)