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1. (WO2017191830) POLYIMIDE RESIN, POLYIMIDE RESIN COMPOSITION, AND POLYIMIDE FILM
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Pub. No.: WO/2017/191830 International Application No.: PCT/JP2017/017156
Publication Date: 09.11.2017 International Filing Date: 01.05.2017
IPC:
C08G 73/10 (2006.01) ,C08K 3/22 (2006.01) ,C08L 79/08 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
20
Oxides; Hydroxides
22
of metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Applicants:
三菱瓦斯化学株式会社 MITSUBISHI GAS CHEMICAL COMPANY, INC. [JP/JP]; 東京都千代田区丸の内二丁目5番2号 5-2, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008324, JP
Inventors:
安孫子 洋平 ABIKO, Yohei; JP
末永 修也 SUENAGA, Shuya; JP
関口 慎司 SEKIGUCHI, Shinji; JP
Agent:
大谷 保 OHTANI, Tamotsu; JP
Priority Data:
2016-09259002.05.2016JP
Title (EN) POLYIMIDE RESIN, POLYIMIDE RESIN COMPOSITION, AND POLYIMIDE FILM
(FR) RÉSINE POLYIMIDE, COMPOSITION DE RÉSINE POLYIMIDE, ET PELLICULE POLYIMIDE
(JA) ポリイミド樹脂、ポリイミド樹脂組成物、及びポリイミドフィルム
Abstract:
(EN) The present invention relates to the following: a polyimide resin having a constituent unit A derived from a tetracarboxylic acid dianhydride and a constituent unit B derived from a diamine, wherein the constituent unit A includes a constituent unit (A-1) derived from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride and the constituent unit B includes a constituent unit derived from an aliphatic diamine; a polyimide resin composition including the polyimide resin and inorganic microparticles; and a polyimide film including the polyimide resin or the polyimide resin composition. The present invention provides: a polyimide resin that makes it possible to form a film having heat resistance, colorless transparency, and low water absorbency; a polyimide resin composition; and a polyimide film.
(FR) La présente invention concerne : une résine polyimide possédant un motif constitutif A dérivé d’un dianhydride d’acide tétracarboxylique et un motif constitutif B dérivé d’une diamine, le motif constitutif A comprenant un motif constitutif (A-1) dérivé d’anhydride 4,4’-(hexafluoroisopropylidène)diphtalique et le motif constitutif B comprenant un motif constitutif dérivé d’une diamine aliphatique ; une composition de résine polyimide comprenant la résine polyimide et des microparticules inorganiques ; et une pellicule polyimide comprenant la résine polyimide ou la composition de résine polyimide. La présente invention concerne : une résine polyimide qui rend possible la formation d’une pellicule présentant une résistance à la chaleur, une transparence incolore, et une faible absorption d’eau ; une composition de résine polyimide ; et une pellicule polyimide.
(JA) 本発明は、テトラカルボン酸二無水物に由来する構成単位A、及びジアミンに由来する構成単位Bを有するポリイミド樹脂であって、構成単位Aが、4,4'-(ヘキサフルオロイソプロピリデン)ジフタル酸無水物に由来する構成単位(A-1)を含み、構成単位Bが脂肪族ジアミンに由来する構成単位を含む、ポリイミド樹脂、該ポリイミド樹脂と無機微粒子とを含むポリイミド樹脂組成物、及び該ポリイミド樹脂又は該ポリイミド樹脂組成物を含むポリイミドフィルムに関し、耐熱性、無色透明性に加えて、低吸水性を兼ね備えたフィルムを形成できるポリイミド樹脂、ポリイミド樹脂組成物及びポリイミドフィルムを提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)