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1. (WO2017191726) MULTILAYER WIRING BOARD AND PROBE CARD IN WHICH SAME IS USED

Pub. No.:    WO/2017/191726    International Application No.:    PCT/JP2017/014387
Publication Date: Fri Nov 10 00:59:59 CET 2017 International Filing Date: Fri Apr 07 01:59:59 CEST 2017
IPC: G01R 1/073
G01R 31/26
H01L 21/66
Applicants: KABUSHIKI KAISHA NIHON MICRONICS
株式会社日本マイクロニクス
Inventors: OTABE Noboru
小田部 昇
FUKAMI Yoshiyuki
深見 美行
Title: MULTILAYER WIRING BOARD AND PROBE CARD IN WHICH SAME IS USED
Abstract:
This invention is provided with: an insulating plate 41 comprising a plurality of insulating synthetic resin layers; wiring circuits 44a, 44b, 44c provided to the insulating plate 41; a thin-film resistor 46 formed so as to be embedded in the insulating plate 41, the thin-film resistor 46 being electrically connected to the wiring circuits 44a, 44b, 44c; a heat dissipation part 47 provided on one surface of the insulating plate so as to face the thin-film resistor 46 across some of the plurality of insulating synthetic resin layers, the heat dissipation part 47 having a thermal conductivity higher than that of the insulating plate 41; a pedestal part 48 formed so as to be embedded in the insulating plate 41, the pedestal part 48 being provided so as to face the thin-film resistor 46 on the side opposite the heat dissipation part 47 across some of the plurality of insulating synthetic resin layers and having a thermal conductivity higher than that of the insulating plate 41; and a heat dissipation-pedestal connection part 49 provided so as to connect the heat dissipation part 47 and the pedestal part 48, the heat dissipation-pedestal connection part 49 having a thermal conductivity higher than that of the insulating plate 41.