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1. (WO2017191671) POLISHING COMPOSITION

Pub. No.:    WO/2017/191671    International Application No.:    PCT/JP2016/063549
Publication Date: Fri Nov 10 00:59:59 CET 2017 International Filing Date: Tue May 03 01:59:59 CEST 2016
IPC: C09K 3/14
B24B 37/00
Applicants: NITTA HAAS INCORPORATED
ニッタ・ハース株式会社
Inventors: EZAWA, Shunji
江澤 俊二
DAITO, Takeshi
大藤 健
CHINEN, Mika
知念 美佳
MORIYAMA, Kazuki
森山 和樹
Title: POLISHING COMPOSITION
Abstract:
Provided is a polishing composition capable of polishing a sapphire wafer at an excellent polishing rate. The polishing composition contains silica particles, a glycol ether compound, and water. The content of glycol ether compound in the polishing composition is 0.1 mass percent to 10 mass percent inclusive.