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1. (WO2017191671) POLISHING COMPOSITION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/191671    International Application No.:    PCT/JP2016/063549
Publication Date: 09.11.2017 International Filing Date: 02.05.2016
IPC:
C09K 3/14 (2006.01), B24B 37/00 (2012.01)
Applicants: NITTA HAAS INCORPORATED [JP/JP]; 4-26, Sakuragawa 4-chome, Naniwa-ku, Osaka-shi, Osaka 5560022 (JP)
Inventors: EZAWA, Shunji; (JP).
DAITO, Takeshi; (JP).
CHINEN, Mika; (JP).
MORIYAMA, Kazuki; (JP)
Agent: UEBA Hidetoshi; (JP)
Priority Data:
Title (EN) POLISHING COMPOSITION
(FR) COMPOSITION DE POLISSAGE
(JA) 研磨用組成物
Abstract: front page image
(EN)Provided is a polishing composition capable of polishing a sapphire wafer at an excellent polishing rate. The polishing composition contains silica particles, a glycol ether compound, and water. The content of glycol ether compound in the polishing composition is 0.1 mass percent to 10 mass percent inclusive.
(FR)L'invention concerne une composition de polissage capable de polir une tranche de saphir à un excellent taux de polissage. La composition de polissage contient des particules de silice, un composé éther de glycol et de l'eau. La teneur en composé éther de glycol dans la composition de polissage est de 0,1 % en masse à 10 % en masse inclus.
(JA)優れた研磨速度でサファイアウェーハを研磨することができる研磨用組成物を提供する。研磨用組成物は、シリカ粒子と、グリコールエーテル化合物と、水と、を含む。研磨用組成物に含まれるグリコールエーテル化合物の含有量は、0.1質量%以上且つ10質量%以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)