WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |

Search International and National Patent Collections
World Intellectual Property Organization
Machine translation
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/191667    International Application No.:    PCT/JP2016/063526
Publication Date: 09.11.2017 International Filing Date: 02.05.2016
H02M 7/48 (2007.01), H02M 1/00 (2007.01)
Applicants: MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310 (JP)
Inventors: KITAJIMA Yumie; (JP).
SAITO Shota; (JP)
Agent: YOSHITAKE Hidetoshi; (JP)
Priority Data:
(JA) 電力変換装置
Abstract: front page image
(EN)A P-side substrate 3p of a semiconductor module 100a and an N-side substrate 3n of a semiconductor module 100b are disposed adjacent to each other along an intersection segment Lx2 that intersects a direction Dr1 in plan view. A circuit Cr1a is provided to the P-side substrate 3p. A circuit Cr1b is provided to the N-side substrate 3n. The circuit Cr1a is not driven when the circuit Cr1b is driven. The circuit Cr1b is not driven when the circuit Cr1a is driven.
(FR)Selon la présente invention, un substrat côté P (3p) d'un module à semi-conducteur (100a) et un substrat côté N (3n) d'un module à semi-conducteur (100b) sont disposés adjacents l'un à l'autre le long d'un segment d'intersection (Lx2) qui coupe une direction (Dr1) selon une vue en plan. Un circuit (Cr1a) est disposé sur le substrat côté P (3p). Un circuit (Cr1b) est disposé sur le substrat côté N (3n). Le circuit (Cr1a) n'est pas entraîné lorsque le circuit (Cr1b) est entraîné. Le circuit (Cr1b) n'est pas entraîné lorsque le circuit (Cr1a) est entraîné.
(JA) 半導体モジュール100aのP側基板3p、および、半導体モジュール100bのN側基板3nは、平面視において方向Dr1と交差する交差線分Lx2に沿って、隣接して配置されている。P側基板3pには回路Cr1aが設けられている。N側基板3nには回路Cr1bが設けられている。回路Cr1aは、回路Cr1bが駆動しているときには、駆動しない。回路Cr1bは、回路Cr1aが駆動しているときには、駆動しない。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)