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1. (WO2017191496) INTEGRATED LIGHT EMITTING DIODES HEAD-UP CLUSTER
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/191496 International Application No.: PCT/IB2016/052588
Publication Date: 09.11.2017 International Filing Date: 06.05.2016
IPC:
B60K 35/00 (2006.01) ,B60K 37/02 (2006.01) ,G02B 27/01 (2006.01) ,B60R 1/02 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
60
VEHICLES IN GENERAL
K
ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS; AUXILIARY DRIVES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST, OR FUEL SUPPLY, OF PROPULSION UNITS, IN VEHICLES
35
Arrangement or adaptations of instruments
B PERFORMING OPERATIONS; TRANSPORTING
60
VEHICLES IN GENERAL
K
ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS; AUXILIARY DRIVES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST, OR FUEL SUPPLY, OF PROPULSION UNITS, IN VEHICLES
37
Dashboards
02
Arrangement of instruments
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
27
Other optical systems; Other optical apparatus
01
Head-up displays
B PERFORMING OPERATIONS; TRANSPORTING
60
VEHICLES IN GENERAL
R
VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
1
Optical viewing arrangements
02
Rear-view mirror arrangements
Applicants: CONTINENTAL AUTOMOTIVE GMBH[DE/DE]; Vahrenwalder Straße 9 30165 Hanover Germany, DE
Inventors: TENG, Ling Chih; SG
WU, Yu; SG
LIM, Yen Nie; SG
ZHAO, Jianbo; SG
Agent: SCHWEIGER, Martin; SG
Priority Data:
Title (EN) INTEGRATED LIGHT EMITTING DIODES HEAD-UP CLUSTER
(FR) GROUPE TÊTE HAUTE À DIODES ÉLECTROLUMINESCENTES INTÉGRÉES
Abstract:
(EN) The application provides an instrument cluster for a vehicle. The instrument cluster comprises a vehicle communication bus terminal for receiving at least one vehicle parameter signal, a processor for generating an instrument cluster display signal according to the vehicle parameter signal, an instrument cluster gauge for displaying the instrument cluster display signal, and a head-up display unit. The head-up display unit comprises a light source element and a head-up light-guide element. The processor is adapted to activate the light source element for emitting at least one head-up light ray according to the vehicle parameter signal. The head-up light-guide element is adapted for transporting the head-up light ray to an optical combiner for reflecting to the driver. The instrument cluster further comprises a single integrated printed circuit board. The vehicle communication bus terminal, the processor, and the light source element are provided on the single integrated printed circuit board.
(FR) La présente invention concerne un groupe d'instruments pour un véhicule. Le groupe d'instruments comprend une borne de bus de communication de véhicule permettant de recevoir au moins un signal de paramètre de véhicule, un processeur permettant de générer un signal d'affichage de groupe d'instruments selon le signal de paramètre de véhicule, une jauge de groupe d'instruments permettant d'afficher le signal d'affichage de groupe d'instruments, et une unité d'affichage tête haute. L'unité d'affichage tête haute comprend un élément source lumineuse et un élément de guidage de lumière tête haute. Le processeur est conçu pour activer l'élément source lumineuse pour émettre au moins un rayon lumineux tête haute en fonction du signal de paramètre de véhicule. L'élément de guidage de lumière tête haute est conçu pour transporter le rayon de lumière tête haute vers un combinateur optique pour une réflexion vers le conducteur. Le groupe d'instruments comprend en outre une unique carte de circuit imprimé intégrée. La borne de bus de communication de véhicule, le processeur et l'élément source lumineuse sont disposés sur la carte de circuit imprimé intégrée unique.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)