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1. (WO2017190974) THERMAL BLOCK ASSEMBLY, LED ARRANGEMENT WITH THE SAME, AND METHOD OF MANUFACTURING SAID THERMAL ASSEMBLY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/190974    International Application No.:    PCT/EP2017/059709
Publication Date: 09.11.2017 International Filing Date: 25.04.2017
IPC:
H01L 33/64 (2010.01), H01L 33/62 (2010.01), F21V 29/74 (2015.01), H01L 33/00 (2010.01), F21Y 115/10 (2016.01)
Applicants: LUMILEDS HOLDING B.V. [NL/NL]; Schiphol Boulevard 127 1118 BG Schiphol (NL) (AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BE, BF, BG, BH, BJ, BN, BR, BW, BY, BZ, CA, CF, CG, CH, CI, CL, CM, CN, CO, CR, CU, CY, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, FR, GA, GB, GD, GE, GH, GM, GN, GQ, GR, GT, GW, HN, HR, HU, ID, IE, IL, IN, IR, IS, IT, JP, KE, KG, KH, KM, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MC, MD, ME, MG, MK, ML, MN, MR, MT, MW, MX, MY, MZ, NA, NE, NG, NI, NL, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SI, SK, SL, SM, SN, ST, SV, SY, SZ, TD, TG, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, ZA, ZM, ZW only).
LUMILEDS LLC [US/US]; 370 West Trimble Road San Jose, CA California 95131 (US) (US only)
Inventors: KUMS, Gerard; (DE)
Agent: TER HEEGDE, Paul; (DE)
Priority Data:
16167868.5 02.05.2016 EP
Title (EN) THERMAL BLOCK ASSEMBLY, LED ARRANGEMENT WITH THE SAME, AND METHOD OF MANUFACTURING SAID THERMAL ASSEMBLY
(FR) ENSEMBLE BLOC THERMIQUE, AGENCEMENT DE DIODE ÉLECTROLUMINESCENTE (DEL) AYANT CE DERNIER, ET PROCÉDÉ DE FABRICATION DUDIT ENSEMBLE THERMIQUE
Abstract: front page image
(EN)The invention describes a thermal block assembly (1) comprising: a first thermally and electrically conductive block part (10) realised for connection to an anode pad (30) of a light-emitting diode (LED, 3) and dimensioned to provide an essentially complete thermal path (P) for heat originating at the anode pad; a second thermally and electrically conductive block part (11) realised for connection to a cathode pad (31) of the LED (3) and dimensioned to provide an essentially complete thermal path (P) for heat originating at the cathode pad; and a bonding layer (12) applied to the block parts (10, 11) to fix the positions of the block parts on either side of a gap (G). The invention further describes an LED arrangement (5) comprising said thermal block assembly (1) and at least one LED (3) mounted thereto, and a method of manufacturing said thermal block assembly (1).
(FR)L'invention concerne un ensemble bloc thermique (1) comprenant : une première partie de bloc thermiquement et électriquement conductrice (10) conçue pour être connectée à un plot d'anode (30) d'une diode électroluminescente (DEL, 3) et dimensionnée pour fournir un chemin thermique (P) essentiellement complet pour la chaleur provenant du plot d'anode ; une seconde partie de bloc thermiquement et électriquement conductrice (11) conçue pour être connectée à un plot de cathode (31) de la DEL (3) et dimensionnée pour fournir un chemin thermique (P) essentiellement complet pour la chaleur provenant du plot de cathode ; et une couche de liaison (12) appliquée aux parties de bloc (10, 11) pour fixer les positions des parties de bloc de part et d'autre d'un espace (G). L'invention concerne en outre un agencement de DEL (5) comprenant ledit ensemble bloc thermique (1) et au moins une DEL (3) montée sur ce dernier, et un procédé de fabrication dudit ensemble bloc thermique (1).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)