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1. (WO2017190347) PACKAGE STRUCTURE WITH SOLDER BALLS AND MANUFACTURING METHOD THEREOF
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/190347 International Application No.: PCT/CN2016/081286
Publication Date: 09.11.2017 International Filing Date: 06.05.2016
IPC:
H01L 23/488 (2006.01)
Applicants: HUAWEI TECHNOLOGIES CO., LTD.[CN/CN]; Huawei Administration Building, Bantian,Longgang District Shenzhen, Guangdong 518129, CN
Inventors: DING, Haixing; CN
Agent: GUANGZHOU SCIHEAD PATENT AGENT CO., LTD.; Room 1508, Huihua Commercial & Trade Building No. 80, XianLie Zhong Road,Yuexiu District Guangzhou, Guangdong 510070, CN
Priority Data:
Title (EN) PACKAGE STRUCTURE WITH SOLDER BALLS AND MANUFACTURING METHOD THEREOF
(FR) STRUCTURE D’ENCAPSULATION AVEC BILLES DE SOUDURE ET SON PROCÉDÉ DE FABRICATION
(ZH) 具有焊球的封装结构及封装结构的制造方法
Abstract: front page image
(EN) A package structure with solder balls and a manufacturing method thereof, wherein the package structure comprises a package body (10), pads (20), reinforcement structures (30) and solder balls (40). The pads (20) are disposed on a surface of the package body (10), the solder balls (40) are fixed to the pads (20), and the reinforcement structures (30) are connected to the pads (20) and embedded in the solder balls (40) to improve the connection strength between the solder balls (40) and the pads (20). The package structure can improve the connection strength between the solder balls and the package body, and thus ensure the reliability of the package structure.
(FR) La présente invention concerne une structure d'encapsulation avec des billes de soudure et son procédé de fabrication, la structure d'emballage comprenant un corps d’encapsulation (10), des plots (20), des structures de renforcement (30) et des billes de soudure (40). Les plots (20) sont disposés sur une surface du corps d’encapsulation (10), les billes de soudure (40) sont fixées aux plots (20), et les structures de renforcement (30) sont connectées aux plots (20) et incorporées dans les billes de soudure (40) pour améliorer la résistance de raccordement entre les billes de soudure (40) et les plots (20). La structure d'encapsulation peut améliorer la résistance de raccordement entre les billes de soudure et le corps d’encapsulation, et assurer ainsi la fiabilité de la structure d’encapsulation.
(ZH) 一种具有焊球的封装结构及其制造方法,其中所述封装结构包括封装主体(10)、焊盘(20)、补强结构(30)及焊球(40),所述焊盘(20)设置于所述封装主体(10)的表面,所述焊球(40)固定于所述焊盘(20),所述补强结构(30)连接至焊盘(20)且内埋于所述焊球(40)中,以增强所述焊球(40)与所述焊盘(20)之间的连接强度。所述封装结构能够提升焊球与封装主体之间的连接强度,保证封装结构的可靠性。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)