A printed circuit board is provided. The board includes a plurality of vias through the printed circuit board, each having a first section with a first width, a second section with a second width less than the first width, and a third section with a third width greater than the second width and less than the first width. The second section is located between the first section and the third section, the first and second sections are plated, and the third section lacks plating. At least one of the plurality of vias has the first width dimensioned to receive a connector pin inserted through the first face. A further at least one of the plurality of vias has the first width dimensioned to receive a further connector pin inserted through the second face. Further versions of the printed circuit board and method of making a printed circuit board are provided.