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1. (WO2017188612) SYSTEM AND METHOD FOR REMOVING FOREIGN SUBSTANCES BY USING ELECTRIC FIELD ADSORPTION METHOD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/188612    International Application No.:    PCT/KR2017/003349
Publication Date: 02.11.2017 International Filing Date: 28.03.2017
IPC:
H01L 21/465 (2006.01), H01L 21/02 (2006.01), H01L 21/306 (2006.01), H01L 21/67 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 128, Yeoui-daero, Yeongdeungpo-gu, Seoul 07336 (KR)
Inventors: SHIN, Dongmyung; (KR).
CHUN, Sang Ki; (KR).
LEE, Bum Woo; (KR)
Agent: CHUNG, Soon-Sung; (KR)
Priority Data:
10-2016-0051689 27.04.2016 KR
Title (EN) SYSTEM AND METHOD FOR REMOVING FOREIGN SUBSTANCES BY USING ELECTRIC FIELD ADSORPTION METHOD
(FR) SYSTÈME ET PROCÉDÉ D'ÉLIMINATION DE SUBSTANCES ÉTRANGÈRES À L'AIDE D'UN PROCÉDÉ D'ADSORPTION DE CHAMP ÉLECTRIQUE
(KO) 전기장 흡착 방식을 이용한 이물질 제거 시스템 및 제거 방법
Abstract: front page image
(EN)The present invention relates to a system and a method for removing foreign substances by using an electric field adsorption method, and in which: foreign substances on the surface of a film can be easily adsorbed and removed by using an electric field adsorption method through a micro current (several micro-amperes) voltage driving method, instead of using surface treatment that causes a damage on the surface of the film, such as plasma discharge treatment, corona discharge treatment, and air blowing treatment in a treatment process for removing foreign substances on the surface of the film so as to reduce a safety accident rate of a worker by excluding, especially, a high-voltage discharge treatment or the like and prevent scratches from occurring on the surface of the film.
(FR)La présente invention concerne un système et un procédé d'élimination de substances étrangères à l'aide d'un procédé d'adsorption de champ électrique qui permet d'adsorber et d'éliminer facilement des substances étrangères sur la surface d'un film par utilisation d'un procédé d'adsorption de champ électrique par l'intermédiaire d'un procédé d'attaque de tension de micro-courant (plusieurs micro-ampères), plutôt que d'utiliser un traitement de surface qui endommage la surface du film, tel qu'un traitement par décharge plasma, un traitement par décharge à effet couronne et un traitement par soufflage d'air dans un processus de traitement de façon à éliminer des substances étrangères sur la surface du film afin de réduire un taux d'accidents liés à la sécurité d'un travailleur en excluant, en particulier, un traitement par décharge haute tension ou autre, et d'empêcher que des rayures n'apparaissent sur la surface du film.
(KO)본 발명은 필름 표면의 이물질을 제거하기 위한 처리 공정에 있어서 필름 표면의 이물질을 제거하기 위한 처리 공정에 있어서 플라즈마 방전 처리, 코로나 방전 처리, 에어 블로잉 처리 등과 같이 필름 표면의 손상을 야기하는 표면 처리 방식이 아닌, 미세전류(수마이크로 암페어) 전압구동방식을 통한 전기장 흡착 방식을 이용하여 필름 표면의 이물질을 용이하게 흡착 제거할 수 있으며, 특히 고압의 방전 처리 등을 배제하여 작업자의 안전 사고 발생률을 감소시키고 또한 필름 표면에 스크래치를 발생시키지 않도록 하는 전기장 흡착 방식을 이용한 이물질 제거 시스템 및 제거 방법에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)