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. (WO2017188446) CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CONNECTION STRUCTURE PRODUCTION METHOD

Pub. No.:    WO/2017/188446    International Application No.:    PCT/JP2017/017032
Publication Date: Fri Nov 03 00:59:59 CET 2017 International Filing Date: Sat Apr 29 01:59:59 CEST 2017
IPC: H01B 1/20
H01B 1/00
H01L 21/60
H05K 3/32
Applicants: SHARP KABUSHIKI KAISHA
シャープ株式会社
OSAKA UNIVERSITY
国立大学法人大阪大学
Inventors: SATOH, Tomotoshi
佐藤 知稔
SATO, Hiroya
佐藤 浩哉
SUGANUMA, Katsuaki
菅沼 克昭
SUETAKE, Aiji
末武 愛士
NAGAO, Shijo
長尾 至成
JIU, Jinting
酒 金▲てい▼
KIHARA, Seiichiro
木原 誠一郎
Title: CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CONNECTION STRUCTURE PRODUCTION METHOD
Abstract:
The objective of the invention is to obtain an electrode that is similar to a protruding electrode which independently stands on a base plate. The conductive paste (202) contains a conductive powder and an alcoholic liquid component, and contains no adhesive. The conductive powder contains conductive particles with a thickness of between 0.05 μm and 0.1 μm inclusive, and have a representative length, which is the maximum span in a plane orthogonal to the thickness direction, of between 5 μm and 10 μm inclusive. With respect to the conductive paste, the weight ratio of the alcoholic liquid component is between 8% and 20% inclusive.