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1. (WO2017188446) CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CONNECTION STRUCTURE PRODUCTION METHOD
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Pub. No.: WO/2017/188446 International Application No.: PCT/JP2017/017032
Publication Date: 02.11.2017 International Filing Date: 28.04.2017
IPC:
H01B 1/20 (2006.01) ,H01B 1/00 (2006.01) ,H01L 21/60 (2006.01) ,H05K 3/32 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
Applicants:
シャープ株式会社 SHARP KABUSHIKI KAISHA [JP/JP]; 大阪府堺市堺区匠町1番地 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522, JP
国立大学法人大阪大学 OSAKA UNIVERSITY [JP/JP]; 大阪府吹田市山田丘1番1号 1-1, Yamadaoka, Suita-shi, Osaka 5650871, JP
Inventors:
佐藤 知稔 SATOH, Tomotoshi; --
佐藤 浩哉 SATO, Hiroya; --
菅沼 克昭 SUGANUMA, Katsuaki; JP
末武 愛士 SUETAKE, Aiji; JP
長尾 至成 NAGAO, Shijo; JP
酒 金▲てい▼ JIU, Jinting; JP
木原 誠一郎 KIHARA, Seiichiro; JP
Agent:
特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK; 大阪府大阪市北区天神橋2丁目北2番6号 大和南森町ビル Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
2016-09180428.04.2016JP
Title (EN) CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CONNECTION STRUCTURE PRODUCTION METHOD
(FR) PÂTE CONDUCTRICE, STRUCTURE DE CONNEXION D'ÉLECTRODE ET PROCÉDÉ DE FABRICATION DE STRUCTURE DE CONNEXION D'ÉLECTRODE
(JA) 導電性ペースト、電極接続構造、及び、電極接続構造の製造方法
Abstract:
(EN) The objective of the invention is to obtain an electrode that is similar to a protruding electrode which independently stands on a base plate. The conductive paste (202) contains a conductive powder and an alcoholic liquid component, and contains no adhesive. The conductive powder contains conductive particles with a thickness of between 0.05 μm and 0.1 μm inclusive, and have a representative length, which is the maximum span in a plane orthogonal to the thickness direction, of between 5 μm and 10 μm inclusive. With respect to the conductive paste, the weight ratio of the alcoholic liquid component is between 8% and 20% inclusive.
(FR) L'objectif de l'invention est d'obtenir une électrode qui soit similaire à une électrode saillante qui se dresse indépendamment sur une plaque de base. Une pâte conductrice (202) selon l'invention contient une poudre conductrice et un composant liquide alcoolique, et ne contient pas d'adhésif. La poudre conductrice contient des particules conductrices qui ont une épaisseur comprise entre 0,05 µm et 0,1 µm inclus, et présentent une longueur représentative, qui est l'étendue maximale dans un plan orthogonal à la direction de l'épaisseur, comprise entre 5 µm et 10 µm inclus. Par rapport à la pâte conductrice, le rapport en poids du composant liquide alcoolique est compris entre 8 % et 20 % inclus.
(JA) 基板に自立する突起電極のような電極を得る。導電性ペースト(202)は、導電粉末とアルコール系液体成分とを含み、接着剤を含まず、前記導電性粉末は、厚さが0.05μm以上0.1μm以下であり、当該厚さ方向に垂直な面内の最大の差し渡しである代表長さが5μm以上10μm以下である導電粒子を含み、前記アルコール系液成分は、前記導電性ペーストに対する重量比が、8%以上20%以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)