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1. (WO2017188286) SEALING LIQUID EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/188286    International Application No.:    PCT/JP2017/016444
Publication Date: 02.11.2017 International Filing Date: 25.04.2017
IPC:
C08L 63/00 (2006.01), C08K 5/5415 (2006.01), C08L 83/04 (2006.01), H01L 23/29 (2006.01), H01L 23/31 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP)
Inventors: NOJIRI, Naoyuki; (JP).
TAKAHASHI, Hisato; (JP).
KUNIMI, Makoto; (JP).
HORI, Kohji; (JP)
Agent: TAIYO, NAKAJIMA & KATO; 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022 (JP)
Priority Data:
2016-091947 28.04.2016 JP
Title (EN) SEALING LIQUID EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
(FR) COMPOSITION DE RÉSINE ÉPOXY LIQUIDE DE SCELLEMENT ET DISPOSITIF DE COMPOSANT ÉLECTRONIQUE
(JA) 封止用液状エポキシ樹脂組成物及び電子部品装置
Abstract: front page image
(EN)This sealing liquid epoxy resin composition comprises an epoxy resin, a curing agent, and particles having a core shell structure. The particles having the core shell structure comprise a core portion containing crosslinked polysiloxane, and a shell portion containing a polymer whereof the content of structural units having an epoxy group is 10% by mass or greater.
(FR)Cette composition de résine époxy liquide de scellement comprend une résine époxy, un agent de durcissement et des particules ayant une structure coeur-écorce. Les particules ayant la structure coeur-écorce comprennent une partie coeur contenant du polysiloxane réticulé, et une partie écorce contenant un polymère dont la teneur en unités structurales ayant un groupe époxy est de 10 % en masse ou plus.
(JA)エポキシ樹脂と、硬化剤と、コアシェル構造を有する粒子と、を含み、前記コアシェル構造を有する粒子は、架橋ポリシロキサンを含むコア部と、エポキシ基を有する構成単位の含有率が10質量%以上である重合体を含むシェル部と、を有する、封止用液状エポキシ樹脂組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)