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1. WO2017187781 - POWER CONVERSION DEVICE

Publication Number WO/2017/187781
Publication Date 02.11.2017
International Application No. PCT/JP2017/008301
International Filing Date 02.03.2017
IPC
H02M 7/48 2007.01
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
7Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
42Conversion of dc power input into ac power output without possibility of reversal
44by static converters
48using discharge tubes with control electrode or semiconductor devices with control electrode
CPC
H01L 2224/33
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
33of a plurality of layer connectors
H01L 23/367
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
H01L 23/44
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
44the complete device being wholly immersed in a fluid other than air
H01L 23/473
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 25/115
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
10the devices having separate containers
11the devices being of a type provided for in group H01L29/00
115the devices being arranged next to each other
H02M 7/003
HELECTRICITY
02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
7Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
003Constructional details, e.g. physical layout, assembly, wiring, busbar connections
Applicants
  • 日立オートモティブシステムズ株式会社 HITACHI AUTOMOTIVE SYSTEMS, LTD. [JP]/[JP]
Inventors
  • 大久保 裕 OKUBO Yutaka
  • 諏訪 時人 SUWA Tokihito
  • 高木 佑輔 TAKAGI Yusuke
Agents
  • 戸田 裕二 TODA Yuji
Priority Data
2016-09004228.04.2016JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POWER CONVERSION DEVICE
(FR) DISPOSITIF DE CONVERSION DE COURANT
(JA) 電力変換装置
Abstract
(EN)
In order to improve the reliability of a power conversion device while avoiding increasing the size and cost of the power conversion device, a power conversion device according to the present invention is equipped with power semiconductor modules, and a flow path formation body that houses the power semiconductor modules and forms a flow path in which a refrigerant flows. The flow path formation body forms a first opening running from one surface of the flow path formation body to the flow path. The power semiconductor modules form a first seal surface, which is formed along the direction in which the power semiconductor modules are inserted into the flow path, and faces the flow path formation body, and a second seal surface, which is formed along the insertion direction and faces the flow path formation body.
(FR)
Afin d'améliorer la fiabilité d'un dispositif de conversion de courant tout en évitant d'augmenter la taille et le coût du dispositif de conversion de courant, un dispositif de conversion de courant selon la présente invention est équipé de modules à semi-conducteurs de courant, et d'un corps de formation de chemin d'écoulement qui loge les modules à semi-conducteurs de courant et forme un chemin d'écoulement dans lequel circule un réfrigérant. Le corps de formation de chemin d'écoulement forme une première ouverture s'étendant d'une surface du corps de formation de chemin d'écoulement au chemin d'écoulement. Les modules à semi-conducteurs de courant forment une première surface d'étanchéité, qui est formée le long de la direction dans laquelle les modules à semi-conducteurs de courant sont insérés dans le chemin d'écoulement et fait face au corps de formation de chemin d'écoulement, et une seconde surface d'étanchéité, qui est formée le long de la direction d'insertion et fait face au corps de formation de chemin d'écoulement.
(JA)
電力変換装置が大型化や高コスト化を抑制しながら、電力変換装置の信頼性を向上させることである。 本発明に係る電力変換装置は、パワー半導体モジュールと、前記パワー半導体モジュールを収納するとともに冷媒を流す流路を形成する流路形成体と、を備え、前記流路形成体は、当該流路形成体の一面から前記流路へと連通する第1開口を形成し、 前記パワー半 導体モジュールは、当該パワー半導体モジュールの前記流路への挿入方向に沿って形成されかつ前記流路形成体と対向する第1シール面と、前記挿入方向に沿って形成されかつ前記流路形成体と対向する第2シール面と、を形成する。
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