Search International and National Patent Collections

1. (WO2017187735) ELECTRONIC DEVICE

Pub. No.:    WO/2017/187735    International Application No.:    PCT/JP2017/006538
Publication Date: Fri Nov 03 00:59:59 CET 2017 International Filing Date: Thu Feb 23 00:59:59 CET 2017
IPC: H01L 25/10
H01L 23/12
H01L 25/18
Applicants: SOCIONEXT INC.
株式会社ソシオネクスト
Inventors: IKOMA Heiji
生駒 平治
YONEYAMA Shinichiro
米山 慎一郎
Title: ELECTRONIC DEVICE
Abstract:
The present invention relates to an electronic device (1) wherein a package substrate (20), on which a semiconductor integrated circuit (31) is mounted, is mounted on a printed wiring board (10). A predetermined potential is applied to a first external terminal (21a) of the package substrate (20) from the printed wiring board (10). A first decoupling capacitor (41) is connected to a second external terminal (21b) of the package substrate (20). The second external terminal (21b) is positioned closer to a first pad (32a) than the first external terminal when viewed in plan.