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1. (WO2017186120) IMAGE CAPTURING MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY THEREFOR, MOLDED PHOTOSENSITIVE ASSEMBLY SEMI-FINISHED PRODUCT AND MANUFACTURING METHOD, AND ELECTRONIC DEVICE
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Pub. No.: WO/2017/186120 International Application No.: PCT/CN2017/082000
Publication Date: 02.11.2017 International Filing Date: 26.04.2017
IPC:
H04N 5/225 (2006.01)
Applicants: NINGBO SUNNY OPOTECH CO., LTD.[CN/CN]; 66-68 Shunyu Road, Yuyao Ningbo, Zhejiang 315400, CN
Inventors: WANG, Mingzhu; CN
TANAKA, Takehiko; JP
GUO, Nan; CN
CHEN, Zhenyu; CN
ZHAO, Bojie; CN
MEI, Zhewen; CN
HUANG, Zhen; CN
LUAN, Zhongyu; CN
Agent: NINGBO RAYMOND IP AGENCY FIRM; Suite 1501, 555 Rili Middle Road Shounan Subdistrict, Yinzhou District Ningbo, Zhejiang 315100, CN
Priority Data:
201610278035.028.04.2016CN
201610668807.112.08.2016CN
201610669214.712.08.2016CN
201620373323.X28.04.2016CN
201620875381.212.08.2016CN
201620875383.112.08.2016CN
201620875781.312.08.2016CN
201620876056.812.08.2016CN
Title (EN) IMAGE CAPTURING MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY THEREFOR, MOLDED PHOTOSENSITIVE ASSEMBLY SEMI-FINISHED PRODUCT AND MANUFACTURING METHOD, AND ELECTRONIC DEVICE
(FR) MODULE DE CAPTURE D'IMAGE ET ENSEMBLE PHOTOSENSIBLE MOULÉ POUR CELUI-CI, PRODUIT SEMI-FINI D'ENSEMBLE PHOTOSENSIBLE MOULÉ ET PROCÉDÉ DE FABRICATION ASSOCIÉ, AINSI QUE DISPOSITIF ÉLECTRONIQUE
(ZH) 摄像模组及其模塑感光组件、模塑感光组件的半成品和制造方法以及电子设备
Abstract:
(ZH) 本发明提供一摄像模组及其模塑感光组件、模塑感光组件的半成品和制造方法以及电子设备,其中所述摄像模组的模塑感光组件,其包括至少一支承元件、至少一感光元件、至少一线路板、至少一组引线以及至少一模塑基座。每组所述引线的两端分别被连接于每个所述感光元件的非感光区域和每个所述线路板,每个所述模组基座分别包括一模塑主体和具有一光窗,其中在藉由一成型模具进行模塑工艺以使所述模塑主体成型时,每个所述支承元件分别用于阻止所述成型模具的内表面施压于所述引线,其中所述感光元件的感光区域对应于所述光窗。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)