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1. (WO2017185056) COMPUTER ASSISTED WEAK PATTERN DETECTION AND QUANTIFICATION SYSTEM
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Pub. No.: WO/2017/185056 International Application No.: PCT/US2017/028983
Publication Date: 26.10.2017 International Filing Date: 21.04.2017
IPC:
H01L 21/66 (2006.01) ,H01L 21/027 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
Applicants:
KLA-TENCOR CORPORATION [US/US]; Legal Department One Technology Drive Milpitas, California 95035, US
Inventors:
HAQUE, Noashin; US
PARK, Allen; US
GUPTA, Ajay; US
Agent:
MCANDREWS, Kevin; US
MORRIS, Elizabeth M. N.; US
Priority Data:
15/275,72626.09.2016US
62/326,65322.04.2016US
Title (EN) COMPUTER ASSISTED WEAK PATTERN DETECTION AND QUANTIFICATION SYSTEM
(FR) SYSTÈME DE DÉTECTION ET DE QUANTIFICATION DE MOTIF FAIBLE ASSISTÉES PAR ORDINATEUR
Abstract:
(EN) Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the regions of interest identified, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the weak patterns identified; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.
(FR) L’invention concerne des procédés et des systèmes de mise en œuvre de la détection et de la quantification de motif faible (ou point chaud). Un système de détection et de quantification de motif faible peut inclure un outil d’inspection de plaquette configuré pour inspecter une plaquette et détecter des défauts présents sur la plaquette. Le système peut également inclure au moins un processeur en communication avec l’outil d’inspection de plaquette. Le ou les processeurs peuvent être configurés pour : procéder à un groupement de motifs sur les défauts détectés sur la base du schéma de la plaquette ; identifier des zones d’intérêt sur la base du groupement de motifs ; identifier des motifs faibles contenus dans les zones d’intérêt identifiées, les motifs faibles étant des motifs s’éloignant du schéma d’une quantité supérieure à un seuil ; valider les motifs faibles identifiés ; et déclarer les motifs faibles validés ou faciliter la révision du schéma de la plaquette sur la base des motifs faibles validés.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)