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1. (WO2017184556) GLASS INTERPOSER INTEGRATED ANTENNA FOR INTRACHIP, INTERCHIP AND BOARD COMMUNICATIONS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/184556 International Application No.: PCT/US2017/028054
Publication Date: 26.10.2017 International Filing Date: 18.04.2017
IPC:
H01Q 15/14 (2006.01) ,H01Q 15/18 (2006.01) ,H01Q 19/18 (2006.01) ,H01Q 19/19 (2006.01) ,H05K 3/42 (2006.01) ,H05K 7/06 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
15
Devices for reflection, refraction, diffraction, or polarisation of waves radiated from an aerial, e.g. quasi-optical devices
14
Reflecting surfaces; Equivalent structures
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
15
Devices for reflection, refraction, diffraction, or polarisation of waves radiated from an aerial, e.g. quasi-optical devices
14
Reflecting surfaces; Equivalent structures
18
comprising plurality of mutually inclined plane surfaces, e.g. corner reflector
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
19
Combinations of primary active aerial elements and units with secondary devices, e.g. with quasi-optical devices, for giving the aerial a desired directional characteristic
10
using reflecting surfaces
18
having two or more spaced reflecting surfaces
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
19
Combinations of primary active aerial elements and units with secondary devices, e.g. with quasi-optical devices, for giving the aerial a desired directional characteristic
10
using reflecting surfaces
18
having two or more spaced reflecting surfaces
19
comprising one main concave reflecting surface associated with an auxiliary reflecting surface
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
42
Plated through-holes
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
02
Arrangements of circuit components or wiring on supporting structure
06
on insulating boards
Applicants: UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.[US/US]; 223 Grinter Hall Gainesville, FL 32611, US
Inventors: HWANGBO, Seahee; US
YOON, Yong, Kyu; US
Agent: SCHOEN, Randy, R.; US
Priority Data:
62/323,96618.04.2016US
Title (EN) GLASS INTERPOSER INTEGRATED ANTENNA FOR INTRACHIP, INTERCHIP AND BOARD COMMUNICATIONS
(FR) ANTENNE INTÉGRÉE À INTERPOSEUR EN VERRE POUR COMMUNICATIONS INTRAPUCES, INTERPUCES ET AVEC CARTE
Abstract:
(EN) Various examples are provided for glass interposer integrated antennas for intrachip, interchip and board communications. In one example, a reflector through- glass via (TGV) antenna includes a TGV or group of TGVs extending through a glass substrate. The TGV can extend from a feeding line disposed on a first side of the glass substrate to a loading disc disposed on a second side of the glass substrate. An array of reflector pillars extending through the glass substrate from a ground plane on the first side of the glass substrate to the second side of the glass substrate can also be provided with the array of reflector pillars distributed beyond an outer edge of the loading disc. The TGV antenna can be implemented as a dual mode design and excited at a first frequency to generate an omni-directional radiation pattern and at a second frequency to generate a broadside radiation pattern.
(FR) Divers exemples concernent des antennes intégrées à interposeur en verre pour communications intrapuces, interpuces et avec carte. Dans un exemple, une antenne à réflecteur pourvue d'un trou d'interconnexion à travers le verre (TGV) comprend un TGV ou un groupe de TGV s'étendant à travers un substrat en verre. Le TGV peut s'étendre depuis une ligne d'alimentation disposée sur un premier côté du substrat en verre jusqu'à un disque de chargement disposé sur un second côté du substrat en verre. Un réseau de piliers de réflecteur s'étendant à travers le substrat en verre depuis un plan de sol sur le premier côté du substrat en verre jusqu'au second côté du substrat en verre peut également être pourvu du réseau de piliers de réflecteur réparti au-delà d'un bord externe du disque de chargement. L'antenne à TGV peut être mise en œuvre sous la forme d'une conception à deux modes et excitée à une première fréquence de façon à générer un motif de rayonnement omnidirectionnel et à une seconde fréquence de façon à générer un motif de rayonnement transversal.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)