WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2017183834) THERMALLY CONDUCTIVE BASE MEMBER AND METHOD FOR ASSEMBLING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/183834    International Application No.:    PCT/KR2017/003711
Publication Date: 26.10.2017 International Filing Date: 05.04.2017
IPC:
H01M 10/655 (2014.01), H01M 10/6554 (2014.01), H01M 10/6556 (2014.01), H01M 2/10 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 128, Yeoui-daero Yeongdeungpo-gu Seoul 07336 (KR)
Inventors: DUDLEY, Scott; (US).
MERRIMAN, Robert; (US).
YANG, Hee Kook; (KR)
Agent: YOU ME PATENT AND LAW FIRM; (KR)
Priority Data:
62/324,003 18.04.2016 US
15/149,288 09.05.2016 US
Title (EN) THERMALLY CONDUCTIVE BASE MEMBER AND METHOD FOR ASSEMBLING SAME
(FR) ÉLÉMENT DE BASE THERMOCONDUCTEUR ET SON PROCÉDÉ D'ASSEMBLAGE
(KO) 열 전도성 베이스 부재 및 이를 조립하는 방법
Abstract: front page image
(EN)The present invention provides a thermally conductive base member and a method for assembling the same. The thermally conductive base member comprises first and second metal base members and a top plate. The first metal base member comprises a first bottom plate, first and second female coupling portions, and first and second rib portions. The second metal base member comprises a second bottom plate, a first male coupling portion, and first and second rib portions. The first male coupling portion is connected to the first female coupling portion while being positioned within the first female coupling portion. The top plate is connected to the top surface of the first female coupling portion, the top surface of the second female coupling portion, and the first and second rib portions of the first metal base member, such that a first flow channel is established between the first and second rib portions of the first metal base member and the top plate.
(FR)La présente invention concerne un élément de base thermoconducteur et son procédé d'assemblage. L'élément de base thermoconducteur comprend des premier et deuxième éléments de base métalliques et une plaque supérieure. Le premier élément de base métallique comprend une première plaque inférieure, des première et deuxième parties de couplage femelles, et des première et deuxième parties de nervure. Le deuxième élément de base métallique comprend une deuxième plaque inférieure, une première partie de couplage mâle et des première et deuxième parties de nervure. La première partie de couplage mâle est raccordée à la première partie de couplage femelle tout en étant positionnée dans la première partie de couplage femelle. La plaque supérieure est raccordée à la surface supérieure de la première partie de couplage femelle, à la surface supérieure de la deuxième partie de couplage femelle et aux première et deuxième parties de nervure du premier élément de base métallique, de sorte qu'un premier canal d'écoulement soit établi entre les première et deuxième parties de nervure du premier élément de base métallique et de la plaque supérieure.
(KO)본 발명은 열 전도성 베이스 부재와 그것의 조립 방법을 제공한다. 열 전도성 베이스 부재는 제 1 및 제 2 금속 베이스 부재들과 상단 플레이트를 포함하고 있다. 제 1 금속 베이스 부재는 제 1 하단 플레이트, 제 1 및 제 2 암형 연결부들, 제 1 및 제 2 립부들를 포함하고 있다. 제 2 금속 베이스 부재는 제 2 하단 플레이트, 제 1 수형 연결부, 제 1 및 제 2 립부들를 포함하고 있다. 제 1 수형 연결부는 제 1 암형 연결부 내에 위치하여 연결되어 있다. 상기 제 1 금속 베이스 부재의 제 1 및 2 립부들과 상단 플레이트 사이에 제 1 유로 채널이 설정되도록, 제 1 암형 연결부의 상면, 제 2 암형 연결부의 상면, 및 제 1 금속 베이스 부재의 제 1 및 제 2 립부들에 상단 플레이트가 연결되어 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)