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1. (WO2017183390) LAMINATE STRUCTURE AND METHOD FOR MANUFACTURING SAME
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Pub. No.: WO/2017/183390 International Application No.: PCT/JP2017/012028
Publication Date: 26.10.2017 International Filing Date: 24.03.2017
IPC:
B32B 3/18 (2006.01) ,H01L 21/768 (2006.01) ,H01L 23/532 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
3
Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form
10
characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material
18
characterised by an internal layer formed of separate pieces of material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
768
Applying interconnections to be used for carrying current between separate components within a device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
52
Arrangements for conducting electric current within the device in operation from one component to another
522
including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
532
characterised by the materials
Applicants:
ソニー株式会社 SONY CORPORATION [JP/JP]; 東京都港区港南1丁目7番1号 1-7-1, Konan, Minato-ku, Tokyo 1080075, JP
Inventors:
三浦 利仁 MIURA Toshihiro; JP
Agent:
山本 孝久 YAMAMOTO Takahisa; JP
吉井 正明 YOSHII Masaaki; JP
Priority Data:
2016-08424320.04.2016JP
Title (EN) LAMINATE STRUCTURE AND METHOD FOR MANUFACTURING SAME
(FR) STRUCTURE STRATIFIÉE ET SON PROCÉDÉ DE FABRICATION
(JA) 積層構造体及びその製造方法
Abstract:
(EN) A laminate structure 10 is composed of a first layer 40 that covers a base member 20 and a stepped part 30 existing over the base member 20, and a second layer 60 that covers the first layer 40. Inside the first layer 40, a first seam part 50 is formed with a part 33 where the stepped part 30 rises from the base member 20 or a point in the vicinity of the part 33 as a starting point. Inside the second layer 60, a second seam part 70 is formed with a part 43 where the first layer 40 positioned over the base member 20 rises, or a corresponding part 63 of the second layer 60 in the vicinity of the part 43, as a starting point. The first seam part 50 and the second seam part 70 are discontinuous.
(FR) L'invention concerne une structure stratifiée (10), laquelle structure est constituée par une première couche (40) qui recouvre un élément de base (20), une partie étagée (30) se trouvant sur l'élément de base (20), et une seconde couche (60) qui recouvre la première couche (40). A l'intérieur de la première couche (40), une première partie de raccord (50) est formée avec une partie (33) où la partie étagée (30) s'élève à partir de l'élément de base (20) ou d'un point à proximité de la partie (33) comme point de départ. A l'intérieur de la seconde couche (60), une seconde partie de raccord (70) est formée avec une partie (43) où s'élève la première couche (40) positionnée sur l'élément de base (20), ou une partie correspondante (63) de la seconde couche (60) au voisinage de la partie (43), comme point de départ. La première partie de raccord (50) et la seconde partie de raccord (70) sont discontinues.
(JA) 積層構造体10は、基体20及び基体20上に存在する段差部30を覆う第1の層40、並びに、第1の層40を覆う第2の層60から構成されており、第1の層40の内部には、基体20から段差部30が立ち上がる部分33又はその近傍を始点として第1のシーム部50が形成されており、第2の層60の内部には、基体20の上方に位置する第1の層40が立ち上がる部分43又はその近傍に対応する第2の層60の部分63を始点として第2のシーム部70が形成されており、第1のシーム部50と第2のシーム部70とは不連続である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)