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1. (WO2017183310) ADHESIVE-FILM-INTEGRATED PRESSURE-SENSITIVE ADHESIVE TAPE AND PROCESS FOR PRODUCING SEMICONDUCTOR CHIP

Pub. No.:    WO/2017/183310    International Application No.:    PCT/JP2017/007735
Publication Date: Fri Oct 27 01:59:59 CEST 2017 International Filing Date: Wed Mar 01 00:59:59 CET 2017
IPC: C09J 7/02
C09J 133/08
C09J 175/04
C09J 201/00
H01L 21/301
Applicants: DENKA COMPANY LIMITED
デンカ株式会社
Inventors: SAITO, Takeshi
齊藤 岳史
SHIBAYAMA, Takenori
柴山 雄紀
TANAKA, Tomoaki
田中 智章
Title: ADHESIVE-FILM-INTEGRATED PRESSURE-SENSITIVE ADHESIVE TAPE AND PROCESS FOR PRODUCING SEMICONDUCTOR CHIP
Abstract:
The purpose of the present invention is to provide an adhesive-film-integrated pressure-sensitive adhesive tape which has satisfactory conformability to wafers that have bumps and in which the pressure-sensitive adhesive tape combines adhesion to and separability from the adhesive film, and a process for producing semiconductor chips using said pressure-sensitive adhesive tape. The adhesive-film-integrated pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive tape configured of a base film and a pressure-sensitive adhesive layer and further includes an adhesive film laminated to the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer comprises specific components. Thus, an adhesive-film-integrated pressure-sensitive adhesive tape which has satisfactory conformability to wafers that have bumps and in which the pressure-sensitive adhesive tape combines adhesion to and separability from the adhesive film can be provided.