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1. (WO2017183135) CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE

Pub. No.:    WO/2017/183135    International Application No.:    PCT/JP2016/062507
Publication Date: Fri Oct 27 01:59:59 CEST 2017 International Filing Date: Thu Apr 21 01:59:59 CEST 2016
IPC: H05K 1/16
H05K 1/11
Applicants: FUJITSU LIMITED
富士通株式会社
Inventors: AKAHOSHI, Tomoyuki
赤星 知幸
FURUYAMA, Masaharu
古山 昌治
MIZUTANI, Daisuke
水谷 大輔
Title: CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE
Abstract:
To minimize the decrease in reliability and performance due to heating in a circuit board internally provided with a capacitor. A circuit board (1) having a capacitor (10) provided in an insulating layer (20). The capacitor (10) includes a dielectric layer (11), an electrode layer (12) having an opening part (12a), and an electrode layer (13) having an opening (13a) at a position corresponding to the opening part (12a). The circuit board (1) is provided with a conductor via (31) penetrating the dielectric layer (11), the opening part (12a), and the opening part (13a), the conductor via (31) being smaller than the opening part (12a) and the opening part (13a) in plan view. One of the electrode layers (13) of the capacitor (10) is electrically connected to the conductor via (31) via a connection via (32) provided in the insulating layer (20) and a conductor layer (33) provided on the insulating layer (20).